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Advanced Electronics Packaging Digest

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Molex Launches MiniMix Connectors for Humanoid Robotics

08/06/2026 | PRNewswire
Molex, a global electronics leader and connectivity innovator, unveiled MiniMix Hybrid Power and Signal Connectors, a purpose-built interconnect platform designed to solve manufacturing and packaging challenges in next-generation humanoid robotics, autonomous mobile robots (AMRs) and advanced industrial automation systems.

Voyager Awarded Raytheon Contract Supporting SM-3

08/06/2026 | BUSINESS WIRE
Voyager Technologies has been awarded a contract by Raytheon, an RTX business, to advance propulsion technologies for the Standard Missile-3 (SM-3®) interceptor family.

Rice to Lead $15M Army Research Center for Next-Generation Sensing and Communications

08/05/2026 | Rice University
Rice University has received a $15 million award from the U.S. Army Research Office to establish a five-year research center dedicated to advancing secure sensing, imaging and communications.

Removing the Bottleneck: ZOT's Transition to Direct Imaging

08/05/2026 | Marcy LaRont, I-Connect007
For many PCB fabricators, solder mask imaging can become one of the biggest constraints on production. Traditional exposure methods often involve lengthy setup times, multiple process steps, and opportunities for registration errors, leading to costly rework. ZOT Engineering Ltd., a UK-based contract electronics manufacturer specializing in PCB fabrication and assembly, recently modernized this part of its process by partnering with Schmoll Maschinen to deploy a maskless direct imaging (MDI) system.

Calumet Electronics Installs Fully Automated atg A9a and A9aL Flying Probe Technology for High-speed Electrical Test

08/04/2026 | atg Mycronic GmbH
Atg Mycronic GmbH and IEC USA confirm the delivery of high-speed bare board testing technology to PCB fabricator, Calumet Electronics, in Calumet, Michigan.
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