The Marketing Minute: If Your Marketing Budget Gets Cut in Half, Then What?
Punching Out: How Are the Big Boys in Electronics Doing?
It’s Only Common Sense: Complexity Is the Enemy of Profit
DuPont Launches Pyralux AG Flexible Circuit Materials
May 20, 2019 | DuPontEstimated reading time: 3 minutes
DuPont’s expertise in polymer chemistry has made its line of Pyralux laminates the industry leader in flexible circuit materials for over 30 years. Today, Pyralux boasts a diverse portfolio designed to meet the various flexible circuit needs of consumers in the telecommunications, defense, automotive, aerospace, and medical industries. This year, DuPont continues to grow this portfolio by launching Pyralux AG—a new copper-clad laminate that will enable fabricators to seamlessly transition from prototypes to high volume manufacturing.
Pyralux AG is DuPont’s first copper-clad laminate to be offered in both sheets and rolls with global availability. This means that a fabricator will be able to build a prototype in one region and transfer to commercial production in another region without having to change materials, saving time and money on requalification. Since its launch, Pyralux AG has already been qualified in numerous applications in consumer electronics, including sensors, speakers, batteries, and cameras for smartphones. Beyond consumer electronics, Pyralux AG is also ideal for certain medical and automotive applications.
Pyralux AG is an all-polyimide, double-sided copper-clad laminate that is IPC 4204/11 certified and UL 94 V-0 rated. Typical values for loss tangent and dielectric constant are 0.007 and 3.2, respectively, and dimensional stability is within ±0.07%. It is a drop-in solution that is fully compatible with all conventional flexible circuit fabrication processes, including oxide treatment and wet-chemical, plated-through-hole desmearing. It is offered with electrodeposited and rolled annealed copper in balanced constructions that can range in thickness from seven μm to 35 μm (1 oz/ft2). The dielectric thicknesses range from one-half to two mils. The standard size of a sheet is 18 in. by 24 in. (TD x MD) and a standard roll is 19.7 in. (500 mm) by 328 ft (100 m). Contact your DuPont representative to inquire about product formats and technical data.
Pyralux AG is just the latest addition to DuPont’s broad portfolio of laminates.
- Pyralux AP is the industry standard in terms of electrical and mechanical performance and has withstood the most demanding applications for over 30 years; today, it is playing a key role in the emergence of 5G in advanced telecommunications, military, and aerospace applications
- Pyralux LF is a dependable, acrylic-based product that is offered as a copper-clad laminate, coverlay, bondply, and sheet adhesive
- For applications requiring a UL rating, Pyralux FR is a flame-retardant, acrylic-based product that is offered as a copper-clad laminate, coverlay, bondply, and sheet adhesive
- Pyralux TK is a fluoropolymer/polyimide composite, double-sided copper-clad laminate that exhibits the lowest loss characteristics on the market
- Pyralux HT is a bonding film with the highest service temperature available and low-loss performance when paired with Pyralux AP in high-frequency applications
Outside of Pyralux AG, DuPont has a range of products that play a key role in consumer electronics.
- Pyralux TAH and TAHS are all-polyimide, double- and single-sided copper-clad laminates that recently were qualified by a major OEM for their high-frequency antenna application
- Pyralux HXC is a black coverlay that is the market leader in applications where a uniform, matte black appearance is required
- Pyralux AC is a single-sided, all-polyimide copper-clad laminate that is ideal for applications requiring thin, light, and high-density circuitry along with chip-on-flex attachment
Beyond the Pyralux product line, DuPont offers Interra, a line of embedded capacitance laminates for rigid printed circuit boards, and Temprion, a line of thermal management materials. Interra thin copper-clad laminates are replacing surface-mount chip capacitors in rigid boards, and ultimately increasing reliability, reducing costs, simplifying designs, and decreasing packaging sizes. Temprion products are films and laminates with high thermal conductivities that can dissipate heat in the harshest conditions seen in automotive, defense, and aerospace applications.
To learn more about Pyralux, Interra and Temprion products, visit our www.dupont.com/electronic-materials.html or contact your DuPont representative.
Share on:
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
I-Connect007 Releases The Printed Circuit Designer’s Guide to… Direct Metallization: A Guide to Complex PCB Fabrication
05/13/2026 | I-Connect007As PCB complexity continues to accelerate, fabricators and OEMs are reevaluating long-standing manufacturing processes to meet the demands of AI, HDI, advanced packaging, and next-generation electronics. To address these evolving challenges, I-Connect007 is proud to announce the release of The Printed Circuit Designer’s Guide to… Direct Metallization: A Guide to Complex PCB Fabrication, authored by MacDermid Alpha Solution’s Carmichael Gugliotti.
Driving Innovation: Selecting the Right Laser Source
04/28/2026 | Simon Khesin -- Column: Driving InnovationWhen I first joined Schmoll Maschinen, I brought experience from almost every PCB process, except for laser. As I immersed myself in laser processing, I realized why it can seem so daunting to a newcomer. The complexity arises from three intersecting factors: A vast variety of laser sources: CO2, UV-nano, green-pico, UV-pico, IR-pico, and others; a diverse range of applications: Drilling, cutting, ablation, and more; and an extensive list of materials: These have vastly different absorption rates. Choosing the right machine or laser source is rarely trivial. Even for experienced engineers, answering "Which source is best?" requires examining the business's specific goals.
Institute of Circuit Technology Spring Seminar 2026: A Bright Future in Europe
04/23/2026 | Pete Starkey, I-Connect007Through the leafy lanes and spring flowers of Warwickshire and back to Meridan, the traditional centre of England, and now officially part of the Metropolitan Borough of Solihull in the county of the West Midlands, I attended the Annual General Meeting and Spring Seminar of the Institute of Circuit Technology (ICT) on April 14. Out of the AGM came notable changes in leadership at the top of the Institute: the retirement of Mat Beadel as chair and Emma Hudson as technical director. Effective May 1, Steve Driver is the new chair, and Alun Morgan is the new technical director.
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.
Fresh PCB Concepts: Designing PCBs for Harsh Environments—Reliability Is Engineered Upstream
04/23/2026 | Team NCAB -- Column: Fresh PCB ConceptsWhen engineers hear the phrase “harsh environment,” they usually think of the extreme temperature swings, vibration and shock, pressure changes, or radiation in aerospace. However, aerospace is not the only harsh environment where electronic assemblies must survive. Automotive power electronics, downhole oil and gas tools, marine controls, rail systems, defense platforms, and industrial automation equipment all expose PCBs to environments that are equally unforgiving. The stress mechanisms may differ, but the physics does not.