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May 22, 2019 | SEMIEstimated reading time: 1 minute
North America-based manufacturers of semiconductor equipment posted $1.91 billion in billings worldwide in April 2019 (three-month average basis), according to the April Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI. The billings figure is 4.7% higher than the final March 2019 level of $1.82 billion, and is 29% lower than the April 2018 billings level of $2.69 billion.
“April billings of North American equipment manufacturers increased five percent when compared to the prior month,” said Ajit Manocha, president and CEO of SEMI. “While it is premature to call this upturn an inflection point in this cycle, the current improvement clearly reflects expenditures for advancing technology roadmaps.”
The SEMI Billings report uses three-month moving averages of worldwide billings for North American-based semiconductor equipment manufacturers. Billings figures are in millions of U.S. dollars.
SEMI publishes a monthly North American Billings report and issues the Worldwide Semiconductor Equipment Market Statistics (WWSEMS) report in collaboration with the Semiconductor Equipment Association of Japan (SEAJ). The WWSEMS report currently reports billings by 24 equipment segments and by seven end market regions. SEMI also has a long history of tracking semiconductor industry fab investments in detail on a company-by-company and fab-by-fab basis in its World Fab Forecast and SEMI FabView databases. These powerful tools provide access to spending forecasts, capacity ramp, technology transitions, and other information for over 1,000 fabs worldwide.
The data contained in this release were compiled by David Powell, Inc., an independent financial services firm, without audit, from data submitted directly by the participants. SEMI and David Powell, Inc. assume no responsibility for the accuracy of the underlying data.
About SEMI
SEMI connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies.
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