Annual Edge AI Processor Shipments Forecast to Reach 1.5 Billion Units by 2023
June 4, 2019 | IDCEstimated reading time: 2 minutes
In its first forecast of Artificial Intelligence (AI) edge processors, International Data Corporation (IDC) estimates that worldwide shipments of AI-optimized processors for edge systems will reach 340.1 million units in 2019, an increase of 170.0% over 2018. By 2023, IDC expects the market will reach unit shipments of 1.5 billion and achieve a five-year compound annual growth rate (CAGR) of 64.9%.
The emergence of AI is upending the microprocessor market. While the development of general-purpose processors and graphic processor units (GPUs) have brought tremendous compute capabilities to ever smaller, more mobile, battery-powered devices, they are not ideal platforms for neural network inferencing solutions. AI-optimized processors, both discrete accelerators and host processors with neural network accelerators integrated into the processor, drastically outperform running AI solutions compared to general purpose architectures. Every key supplier is trying to adopt by developing solutions that address the new computing paradigm even as a new class of processing suppliers have entered the market, including a range of venture-backed semiconductor startups launching new IP and accelerators into the market.
The market opportunity for AI-optimized processors will increase as AI solutions expand at the edge of the network and as AI workloads increase beyond basic system optimization tasks and listening for wake words to more valuable functions. In 2018, only 5.1% of edge systems running AI included optimized processors. This penetration rate is expected to reach 40.5% by 2023. Revenues for AI-optimized processors on the edge are expected to reach $40.4 billion by 2023, with a CAGR of 86.4%.
For this forecast, edge systems include primary clients, such as PCs, mobile phones, and tablets; edge infrastructure gateways and servers; and endpoints and IoT devices deployed at the edge of enterprise, government, and home networks. Some of the key application areas for edge AI processors include automotive advanced driver assistant systems (ADAS), gaming systems, smart home, and video surveillance. Other key markets include industrial automation, medical devices, AR/VR devices, and robots and drones.
"The success of AI resides in systems deployed to the edge, where instant decisions made by neural networks can actually create value, unfettered by latency and connectivity issues that can challenge cloud-based solutions," said Michael J. Palma, research director in IDC's Enabling Technologies and Semiconductor research team. "But the promise of AI at the edge depends on the development of highly efficient compute processing elements, optimized for AI workloads, that support the power-constrained nature of most edge systems. Currently, discrete accelerators offer the greatest performance but add to BOM costs. Eventual success will likely rest on the integration of AI-optimized processing elements within host processors."
About IDC
International Data Corporation (IDC) is the premier global provider of market intelligence, advisory services, and events for the information technology, telecommunications, and consumer technology markets. With more than 1,100 analysts worldwide, IDC offers global, regional, and local expertise on technology and industry opportunities and trends in over 110 countries. IDC's analysis and insight helps IT professionals, business executives, and the investment community to make fact-based technology decisions and to achieve their key business objectives. Founded in 1964, IDC is a wholly-owned subsidiary of International Data Group (IDG), the world's leading media, data and marketing services company.
Suggested Items
2025 ASEAN IT Spending Growth Slows to 5.9% as AI-Powered IT Expansion Encounters Post-Boom Normalization
06/26/2025 | IDCAccording to the IDC Worldwide Black Book: Live Edition, IT spending across ASEAN is projected to grow by 5.9% in 2025 — down from a robust 15.0% in 2024.
DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model
06/26/2025 | Andy Shaughnessy, I-Connect007I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.
United Electronics Corporation Advances Manufacturing Capabilities with Schmoll MDI-ST Imaging Equipment
06/24/2025 | United Electronics CorporationUnited Electronics Corporation has successfully installed the advanced Schmoll MDI-ST (XL) imaging equipment at their advanced printed circuit board facility. This significant technology investment represents a continued commitment to delivering superior products and maintaining their position as an industry leader in precision PCB manufacturing.
Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.
OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
06/21/2025 | BUSINESS WIREOKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.