New Interaction Between Thin Film Magnets Discovered
June 5, 2019 | Johannes Gutenberg University MainzEstimated reading time: 2 minutes
We ubiquitously stream videos, we download audiobooks to mobile devices, and we store huge numbers of photos on our devices. In short, the storage capacity we need is growing rapidly. Researchers are working to develop new data storage options. One possibility is the racetrack memory device where the data is stored in nanowires in the form of oppositely magnetized areas, so-called domains.
A research team from Johannes Gutenberg University Mainz (JGU) in Germany, together with colleagues from Eindhoven University of Technology in the Netherlands as well as Daegu Gyeongbuk Institute of Science and Technology and Sogang University in South Korea, has now made a discovery that could significantly improve these racetrack memory devices. Instead of using individual domains, in the future one could store the information in three-dimensional spin structures, making the memories faster and more robust and providing a larger data capacity.
"We were able to demonstrate a hitherto undiscovered interaction," explained Dr. Kyujoon Lee of Mainz University. "It occurs between two thin magnetic layers separated by a non-magnetic layer." Usually, spins align either parallel or antiparallel to each other. This would also be expected for such two separate magnetic layers. However, the situation is different in this work as the researchers have been able to show that in particular systems the spins in the two layers are twisted against each other. More precisely, they couple to be aligned perpendicular with one another at an angle of 90 degrees. This new interlayer coupling interaction was theoretically explained through theoretical calculations performed by the project partners at the Peter Grünberg Institute (PGI) and the Institute for Advanced Simulation (IAS) at Forschungszentrum Jülich.
The Mainz-based researchers examined a number of different combinations of materials grown in multi-layers. They were able to show that this previously unknown interaction exists in different systems and can be engineered by the design of the layers. Theoretical calculations allowed them to understand the underlying mechanisms of this novel effect.
With their results, the researchers reveal a missing component in the interaction between such layers. "These results are very interesting to the scientific community in that they show that the missing antisymmetric element of interlayer interaction exists," commented Dr. Dong-Soo Han from JGU. This opens up the possibility of designing various new three-dimensional spin structures, which could lead to new magnetic storage units in the long term.
Professor Mathias Kläui, senior author of the publication, added: "I am very happy that this collaborative work in an international team has opened a new path to three-dimensional structures that could become a key enabler for new 3D devices. Through the financial support of the German Research Foundation and the German Academic Exchange Service, the DAAD, we were able to exchange students, staff, and professors with our foreign partners in order to realize this exciting work."
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
SEMI Reports Global Silicon Wafer Shipments to Rebound 5.4% in 2025, with New Record Expected by 2028
10/30/2025 | SEMIGlobal shipments of silicon wafers are projected to increase 5.4% in 2025 to 12,824 million square inches (MSI) followed by steady growth through 2028 when the market is expected to reach a new industry record of 15,485 MSI, SEMI reported in its annual silicon shipment forecast.
productronica 2025: iTAC Presents AI-supported Knowledge Platform for Connected Production
10/29/2025 | iTAC Software AGIn modern manufacturing facilities, valuable knowledge is stored in systems, documents, and the minds of employees – often fragmented, isolated, and not centrally available.
Unlocking the Promise of AI in Electronics Manufacturing
10/29/2025 | Shobhit Agrawal, Keysight TechnologiesThe electronics manufacturing industry is rapidly evolving as more complicated products are introduced in the production lines, which require technological advancements even in the production processes. The requirements for production that is efficient, product quality that is greater, and product life cycles that are shorter are more crucial than ever before. In the electronic device life cycle, from design to maintenance, test phases have a significant impact on the economy of the company. Test processes are closely linked to the production volume and impacted by the complexity of the product. For businesses to maintain their competitive edge, they need to adopt innovative solutions and redefine processes.
Better Sustainability Policies for Electronics
10/29/2025 | Diana Radovan, Global Electronics AssociationI joined the Global Electronics Association in August 2025 as the director of sustainability policy. Since then, much has happened in terms of geopolitics and in the development and re-envisioning of sustainability policies in the industry. While the European Commission has released several legislative packages to simplify sustainability requirements (“omnibus”), these developments haven’t yet settled and are not in effect. Given the many recent and ongoing public consultations, with often conflicting input from a broad range of stakeholders, final negotiations remain rather polarized among policymakers.
SEMI Reports Global Silicon Wafer Shipments to Rebound 5.4% in 2025, with New Record Expected by 2028
10/29/2025 | SEMIGlobal shipments of silicon wafers are projected to increase 5.4% in 2025 to 12,824 million square inches (MSI) followed by steady growth through 2028 when the market is expected to reach a new industry record of 15,485 MSI, SEMI reported today in its annual silicon shipment forecast.