New Interaction Between Thin Film Magnets for Faster Memory Devices
June 7, 2019 | Eindhoven University of TechnologyEstimated reading time: 2 minutes
Breakthrough discovery in the field of electromagnetism opens up to the design of three-dimensional spin structures, which could be the basic units of the magnetic storage units of the future.
Image Caption: Interlayer coupling interaction. Two ferromagnetic layers (red, blue) antiparallel aligned (arrows indicate the direction from the south to the north pole) are forced by this electronic effect to ‘twist’ their magnetization (as indicated by the arms) adding a chirality (preferential rotation sense). Photo: Reinoud Lavrijsen, TU/e.
Researchers from Eindhoven University of Technology, Germany and South Korea discovered a new interaction between thin film magnets, which lays the foundations for faster and robust memory devices with larger data capacity.
Nowadays, we ubiquitously stream videos, download audiobooks to mobile devices, and store huge numbers of photos on our devices. Thus, the storage capacity we need is growing rapidly, and researchers are working hard to develop new data storage options. One possibility is represented by the so-called ‘racetrack memory device’, in which data is stored in nanowires in the form of oppositely magnetized layers (‘domains’).
A research team from TU/e, Johannes Gutenberg University (JGU) (Germany), Peter Grunberg Institute (PGI), Daegu Gyeongbuk Institute of Science and Technology (South Korea) and Sogang University (South Korea), has now made a discovery that could significantly improve these racetrack memory devices. Instead of using individual domains, in the future one could store the information in three-dimensional spin structures, making memories faster, more robust and providing a larger data capacity.
New Interaction
The research team was able to demonstrate a hitherto undiscovered interaction, which occurs between two thin magnetic layers separated by a non-magnetic layer. Usually, spins align either parallel or antiparallel to each other. This would also be expected for such two separate magnetic layers. However, in this work, the researchers have been able to show that the spins in the two layers are twisted against each other. More precisely, they couple to align perpendicular, at an angle of 90 degrees with one another.
Reinoud Lavrijsen, assistant professor at Applied Physics: ‘This breakthrough discovery opens up the possibility of designing various new three-dimensional spin structures, which in the long term could lead to new magnetic storage units. The identified interaction, however, is at this moment not strong enough for applications, but we are committed to engineer and optimize this further so that it can be used in future 3-dimensional data storage and logic devices.’
Joint Effort
This research is – in the words of Lavrijsen – ‘an excellent example of collaboration between world-class facilities and expertise’. It was initiated in 2014 by Dr. Dong-Soo Han, former Post-Doc researcher at TU/e, in collaboration with prof. Henk Swagten within the group of Physics of Nanostructures. The materials used for the study were provided by the NanoAccess research laboratory at the TU/e, and they were grown into thin film magnets by Dr. Han and PhD student Youri van Hees, under the supervision of prof. Swagten and Dr. Lavrijsen. The new interlayer coupling interaction was theoretically explained through theoretical calculations performed by project partners at PGI. Researchers from JGU examined a number of different combinations of materials grown in multi-layers.
Subscribe
Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.
Subscribe now to stay informed, competitive, and connected.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
Dragonfly Energy Secures Additional Nevada Tech Hub Funding
05/07/2026 | Globe NewswireDragonfly Energy Holdings Corp., an industry leader in energy storage and maker of Battle Born Batteries®, announced it has been selected for a second consecutive round of funding through the Nevada Tech Hub.
A Necessary Shift From Gerber to IPC-2581
05/07/2026 | Tracy Riggan, Global Electronics AssociationIPC-2581 is an open, vendor-neutral data exchange standard developed by the Global Electronics Association to streamline the exchange of PCB design information across fabrication, assembly, and test. It replaces multiple legacy formats—including industry standards, Gerber, and ODB++—with a single, comprehensive, XML-based dataset that captures all manufacturing details.
NVIDIA, Corning Partner to Boost U.S. AI Manufacturing
05/06/2026 | BUSINESS WIRENVIDIA and Corning Incorporated announced a multiyear commercial and technology partnership to dramatically expand U.S.-based manufacturing of the advanced optical connectivity solutions needed to power next-generation AI infrastructure.
Global Electronics Association and CalcuQuote, an Elisa Industriq Business, Launch Joint Supply Chain Intelligence Initiative
04/29/2026 | Global Electronics AssociationThe Global Electronics Association and CalcuQuote, Elisa Industriq today announced a partnership to deliver timely, actionable supply chain intelligence for the electronics industry.