-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Spotlight on North America
A North America spotlight exploring tariffs, reshoring, AI demand, and supply chain challenges. Plus, insights on cybersecurity, workforce development, and the evolving role of U.S. electronics manufacturing.
Wire Harness Solutions
Explore what’s shaping wire harness manufacturing, and how new solutions are helping companies streamline operations and better support EMS providers. Take a closer look at what’s driving the shift.
Spotlight on Europe
As Europe’s defense priorities grow and supply chains are reassessed, industry and policymakers are pushing to rebuild regional capability. This issue explores how Europe is reshaping its electronics ecosystem for a more resilient future.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Epoch International Installs Viscom AOI and SPI Systems at New Silicon Valley Facility
June 10, 2019 | Viscom Inc.Estimated reading time: 2 minutes
Viscom Inc. has been selected by Epoch International for its AOI and SPI needs at its new facility in Fremont, California. Epoch has been using Viscom’s AOI and SPI systems at its China facility, and recently invested in the Viscom 3D AOI model S3088 ultra blue and 3D SPI model S3088 for its new Silicon Valley location.
Epoch recently relocated its US headquarters and all operations to a state-of-the-art facility in Fremont. Nathan Ashelman, Director of Operations, said: "We selected Viscom for our SPI and AOI because they combine reliable and high-precision machine performance with responsive global service that covers all our facilities and sophisticated data-integration capabilities that allow us to tie into our real-time monitoring and reporting system. Viscom continues to evolve as we do and is a trusted partner for the long term."
The S3088 ultra blue addresses the growing demand for reliable and easy-to-use 3D AOI technology at an economical price. One orthogonal and four angled view cameras provide full 3D defect detection coverage for components and solder joints on PCBs. The algorithm-based technology that Viscom provides will deliver greater measurement accuracy while inspecting components and solder joints, which in-turn provides feedback to gain tighter process control to optimize the overall quality for each product being produced.
The award-winning inspection system S3088 SPI combines the advantages of market-leading Viscom AOI systems with powerful 3D SPI sensor technology and inspects the solder paste deposits with the highest possible speed and precision. Even the most demanding assemblies with CSPs or micro BGAs and pad sizes of 01005 are reliably inspected.
Epoch International is a high-tech design engineering and manufacturing services company with design and prototyping capabilities in California and higher volume manufacturing in Dalian, China. Zero Defects International has been a strategic partner for almost 20 years. For more information, visit www.epoch-int.com.
About Viscom
Viscom AG develops, manufactures and sells high-quality inspection systems. The portfolio encompasses the complete bandwidth of optical and X-ray inspections. In the area of assembly inspection for electronics manufacturing, the company is among the leading suppliers worldwide. Viscom systems can be configured specific to the customer and can be interlinked. The company headquarters and manufacturing location is in Hanover, Germany. With a wide network of branches, applications centers, service support points and representatives, Viscom is represented internationally. Founded in 1984, since 2006 Viscom has been listed on the Frankfurt Stock Exchange (ISIN: DE0007846867). For additional information: www.viscom.com
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
BGA Technology Expands Inspection Capabilities with Creative Electron TruView X-ray System
05/08/2026 | BGA TechnologyBGA Technology, a leading provider of advanced electronics testing and inspection services, has enhanced its inspection capabilities with the addition of a Creative Electron TruView™ Simplex X-ray system at its Holbrook, New York facility.
AQUANOX A4727 and A4625 Lead KYZEN Offerings at SMTA Oregon Expo and Tech Forum
05/06/2026 | KYZENKYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Oregon Expo and Tech Forum scheduled to take place Thursday, May 19 at the Wingspan Event and Conference Center in Hillsboro, Oregon.
Connect the Dots: Designing for the Future of Manufacturing Reality—Surface Finish
05/07/2026 | Matt Stevenson -- Column: Connect the DotsWhen designing the complex boards that many electronic devices require to operate, designers should consider manufacturability at every step. This is my last article focused on designing for the always-evolving manufacturing reality. Choosing the right surface finish has always been important. If you are creating intricate designs with a wide variety of components, like for an ultra-high density interconnect (UHDI) board, surface finish is a critical last step.
Indium to Showcase High-Performance AI Application Solutions at SEMICON SEA 2026
05/01/2026 | Indium CorporationAs a leading provider of advanced materials solutions for today’s demanding AI applications, Indium Corporation® will feature its high-reliability product portfolio at SEMICON SEA 2026, May 5-7, in Kuala Lumpur, Malaysia.
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.