Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

PCBAA, AAM Take on the Fight to Rebuild U.S. Manufacturing in New Documentary

05/05/2026 | Marcy LaRont, I-Connect007
Throughout most of the 20th century, manufacturing was central to the American Dream of providing stable jobs and pathways to upward mobility. Today, more than 80% of global electronics manufacturing capacity resides in China and greater Asia, raising serious concerns about supply chain resilience and national security.

Insulectro: Advanced PCB Fabrication Materials

04/23/2026 | Real Time with... APEX EXPO
Explore advanced PCB fabrication materials with Insulectro's Dain Hertsgaard and Gabriel Zepeda. This interview covers Arlon's innovative polyimide and epoxy solutions, including low-flow options for flex materials and high-performance materials for HDI applications; Qnity's polyimide films for demanding environments, and DuPont Interra's capacitance films for enhanced reliability. Insulectro offers comprehensive service and a commitment to advancing circuit technology

John Andresakis Discusses Integrated Thin-film Resistive Foil Technology

04/10/2026 | Real Time with... APEX EXPO
John Andresakis of Ohmega Ticer shares his advanced solution that offers miniaturization, enhanced electrical performance, and stable resistance for next-generation PCBs. The high-demand applications for high-frequency phased-array antennas in commercial space and military sectors is driving the need for superior RF performance and simplified beam forming.

Thick Film Materials Market 2026: Driving Electronics Innovation

03/19/2026 | EINPresswire.com
Thick Film Materials market to surpass $26 billion in 2030. In comparison, the Integrated Circuits market, which is considered as its parent market, is expected to be approximately $658 billion by 2030, with Thick Film Materials to represent around 4% of the parent market.

Powering the Future: From Thick-Film to DBC—Understanding the Evolution of Ceramic Packaging

02/11/2026 | Brian Buyea -- Column: Powering the Future
Ceramic packaging has quietly powered the electronics revolution for more than half a century. From the earliest thick-film hybrids to today’s direct bond copper (DBC) substrates and metallized aluminum nitride, every step forward in ceramic technology has pushed the limits of reliability, power density, and performance. It’s essential for every design engineer building the next generation of electronic systems to understand this evolution.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in