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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Zhen Ding Partners with Children Are Us Foundation to Empower Individuals with Disabilities

09/03/2026 | Zhen Ding
To promote cultural participation and arts education for individuals with intellectual disabilities, Zhen Ding Technology Group has partnered with the Children Are Us Foundation to support its annual theater and musical training and performance program.

SCHMID Group Reports €46.0 Million 1H 2026 Revenue, Updates Full-Year Guidance

08/25/2026 | SCHMID Group
SCHMID Group N.V., a global leader in advanced manufacturing solutions for the electronics and semiconductor industries, reports its unaudited financial results for the first half of 2026, covering the period ended June 30, 2026, and adjusts its full-year 2026 guidance.

PCB West Panel to Take On What’s Next for PCB Design

08/19/2026 | PCEA
The Printed Circuit Engineering Association (PCEA) has announced a panel discussion on the technologies reshaping printed circuit board design over the next two to five years will take place at PCB West 2026.

Eltek Reports Q2 2026 Results

08/19/2026 | Eltek
 Eltek Ltd., a leading global manufacturer of high-quality printed circuit boards, announced its financial results for the quarter ended June 30, 2026.

IPC Standards Released for Q2 2026

08/14/2026 | Global Electronics Association
Each quarter, the Global Electronics Association releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit electronics.org/ipc-standards. These are the latest releases for Q2 2026.
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