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Advanced Electronics Packaging Digest

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Suggested Items

Elementary, Mr. Watson: The ‘Baton’ Handoff Makes or Breaks the Design

09/03/2026 | John Watson -- Column: Elementary, Mr. Watson
In my previous column in I-Connect007 Magazine, I shared the example of the U.S. men’s 4x100-meter relay team at the Tokyo 2020 Olympics. Trayvon Bromell, Fred Kerley, Ronnie Baker, and Cravon Gillespie were among the fastest sprinters in the world. Reaching the final seemed almost certain. Instead, they finished sixth in their qualifying heat and missed advancing by only two-hundredths of a second. The problem was not speed, experience, or talent. It occurred during the baton exchange. Their failure demonstrated that being exceptional at an individual role does not guarantee collective success. A race can be lost not during the individual legs, but during the brief moments when responsibility changes hands.

HIROSE Electric Americas President Mark Kojak Named to ECIA Manufacturer Council

08/20/2026 | HIROSE Electric Americas
HIROSE Electric Americas is pleased to announce that Mark Kojak, President of HIROSE Electric Americas, has been named to the Electronic Components Industry Association’s (ECIA) Manufacturer Council.

India’s Manufacturing Future Depends on Engineers Who Understand World-Class Production

08/17/2026 | PRNewswire
Caresoft Global and DRIIV (Delhi Research Implementation and Innovation) have signed a Memorandum of Understanding to collaborate for talent development in India.

Heart Aerospace Completes First Flight of Largest Electric Aircraft

08/13/2026 | PRNewswire
Heart Aerospace announced the successful first flight of the company's X1 demonstrator aircraft. Spanning 106 feet, measuring 76 feet nose to tail, and weighing more than 25,000 pounds at takeoff, X1 is the largest battery-electric aircraft ever flown.

A Practical Approach to Material Selection for High Power PCBs

08/17/2026 | Drew Delaney, Isola Group
With AI server architectures demanding high-power converter solutions to improve power efficiency and affordability, PCB design can challenge engineers who treat material selection as a single-variable problem. Pick a laminate for thermal conductivity, and you may experience a CTE mismatch that cracks vias after 50 thermal cycles. Optimize for dielectric loss, and you might sacrifice the isolation margin your certification depends on. High-power boards require consideration of multiple variables, including electrical, thermal, mechanical, reliability, and manufacturability, which cannot be optimized alone.
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