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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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IPC APEX EXPO 2020 Deadline for Papers: June 21
June 20, 2019 | IPCEstimated reading time: 2 minutes
IPC APEX EXPO is the electronics industry's premier technical conference and exhibition, drawing an international audience to experience the latest advancements in design, materials, assembly, processes, inspection, and equipment. Areas of interest are diverse and ever-changing to keep up with the pace of innovation.
Presenting at IPC APEX EXPO provides visibility for you and your organization. The proceedings from the technical conference reach an audience of thousands and are regarded as the best place to follow current technologies and best practices. Your material will be seen by key managers and executives from all segments of the worldwide electronics industry. To recognize exceptional achievement, awards will be presented for "Best Paper."
Presenters from companies such as Ericsson AB, Flextronics, IBM Corporation, Indium Corporation, MacDermid-Enthone, Northrop Grumman Corporation, Oracle Corporation and Robert Bosch GmbH have published papers at previous technical conference sessions at IPC APEX EXPO.
Professional development courses are also a great way to delve deeper into the challenges facing the electronics industry. Instructors of these courses have the largest potential audience and reach a wide swath of attendees focused on learning. This is also a great way to pass on knowledge based on years of experience and leave a legacy.
Technical Conference
Provide an abstract of approximately 300 words that summarizes technical work, covering case histories, research and discoveries. Authors of papers selected for the conference will each receive a detailed speaker manual to assist them with numerous items, including the formatting of their papers and presentation slides.
Conference Paper Timeline: Abstracts due June 21, 2019
Professional Development Courses
Course proposals are solicited from individuals interested in teaching half-day (three-hour) professional development courses on design, manufacturing processes, materials, supply chain and reliability. Travel expenses and honorariums are offered to professional development instructors.
Professional Development Timeline: Proposals due June 24, 2019
For more information on topics, speaker benefits and speaker recognition awards, please visit ipcapexexpo2020.ipc.org/cfp.
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Rachael Temple - AlltematedSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
Global Electronics Association to Testify at the Office of the U.S. Trade Representative Panel on Section 301 Structural Excess Capacity
05/08/2026 | Global Electronics AssociationChris Mitchell, Vice President for Global Government Relations at the Global Electronics Association, will testify before the Office of the U.S. Trade Representative (USTR) Panel on Section 301 Structural Excess Capacity on Friday, May 8.
Hall of Fame Spotlight Series: Highlighting Karen McConnell
05/07/2026 | Dan Feinberg, I-Connect007In 2021, Karen McConnell was awarded the Raymond E. Pritchard Hall of Fame award in recognition of her contributions to the Association and the electronics industry. As a senior staff member and CAD/CAM engineer at Northrop Grumman Enterprise Services, her primary responsibility was to develop a common, shared EDM (Electronic Document Management) library to support the electrical and PCB design tool initiatives across Northrop Grumman Mission Systems.
A Necessary Shift From Gerber to IPC-2581
05/07/2026 | Tracy Riggan, Global Electronics AssociationIPC-2581 is an open, vendor-neutral data exchange standard developed by the Global Electronics Association to streamline the exchange of PCB design information across fabrication, assembly, and test. It replaces multiple legacy formats—including industry standards, Gerber, and ODB++—with a single, comprehensive, XML-based dataset that captures all manufacturing details.
TTC-LLC and TTCI: Smarter Training, Stronger Test at PCB East 2026
04/27/2026 | The Test Connection Inc.The Training Connection LLC (TTC-LLC) and The Test Connection, Inc. (TTCI) will be exhibiting together at PCB East 2026, taking place April 28–May 1 at the DCU Convention Center in Worcester, Massachusetts. Attendees can find both teams at Booth #103 during the main exhibition day on Wednesday, April 29.