The Right Approach: Get Ready for ISO 9001 Version 6
Dan’s Biz Bookshelf: ‘Still Broke: Walmart’s Remarkable Transformation'
Driving Innovation: Depth Routing Processes—Achieving Unparalleled Precision in Complex PCBs
Global Smartphones Sensors Market to See a CAGR of almost 2% during 2019-2023
July 1, 2019 | PRNewswireEstimated reading time: 1 minute
The adoption of sensors in premium range smartphones is increasing significantly, owing to the extensive integration of technologies such as 3D sensing, NFC, fingerprint scanning, air gesture, and facial recognition. These functionalities require the integration of a higher number of sensors in smartphones. Thus, the integration of more sensors in smartphones will lead to the growth of the global smartphones sensors market at a CAGR of almost 2% during 2019-2023.
Emergence of Sensor Fusion Technology
Sensor fusion is formed by combining the sensory inputs derived from distinct sources that offer more accurate results compared with single standalone sensors. Sensor fusion technology can facilitate interoperability and easily combine data from various sensors. This has encouraged smartphone OEMs to deploy the technology for AR applications. Thus, the emergence of sensor fusion technology will have a positive impact on the global smartphones sensors market during the forecast period.
Competitive Landscape
With the presence of a few major players, the global sensors market for smartphones is concentrated. Our robust vendor analysis is designed to help clients improve their market position, and in line with this, this report provides a detailed analysis of several leading smartphone sensors manufacturers, that include ALPS ALPINE CO. LTD., ams AG, Robert Bosch GmbH, SAMSUNG ELECTRONICS CO. LTD., STMicroelectronics NV.
Also, the smartphones sensors market analysis report includes information on upcoming trends and challenges that will influence market growth. This is to help companies strategize and leverage on all forthcoming growth opportunities.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
United Electronics Corporation Unveils Revolutionary CIMS Galaxy 30 Automated Optical Inspection System
09/11/2025 | United Electronics CorporationUnited Electronics Corporation (UEC) today announced the launch of its new groundbreaking CIMS Galaxy 30 Automated Optical Inspection (AOI) machine, setting a new industry standard for precision electronics manufacturing quality control. The Galaxy 30, developed and manufactured by CIMS, represents a significant leap forward in inspection technology, delivering exceptional speed improvements and introducing cutting-edge artificial intelligence capabilities.
Intel Announces Key Leadership Appointments to Accelerate Innovation and Strengthen Execution
09/09/2025 | Intel CorporationIntel Corporation today announced a series of senior leadership appointments that support the company’s strategy to strengthen its core product business, build a trusted foundry, and foster a culture of engineering across the business.
DARPA, State of New Mexico Establish Framework to Advance Quantum Computing
09/08/2025 | DARPAAs part of the Quantum Benchmarking Initiative (QBI), DARPA signed an agreement with the State of New Mexico’s Economic Development Department to create the Quantum Frontier Project.
LPKF Strengthens LIDE Technology Leadership with New Patent Protection in Korea
09/04/2025 | LPKFLPKF Laser & Electronics SE today announced that its groundbreaking LIDE (Laser Induced Deep Etching) technology has received additional patent protection in Korea through the Korean Patent Office (KPCA), effective September 1, 2025.
UHDI Fundamentals: UHDI Technology and Industry 4.0
09/03/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in the context of Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. Here, I’ll explore the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.