Global Smart Cities Market Expected to Reach $237.6 Billion by 2025
July 1, 2019 | PRNewswireEstimated reading time: 2 minutes
The global smart cities market is expected to reach USD 237.6 billion by 2025, expanding at a CAGR of 18.9% from 2019 to 2025. Smart cities encapsulate an overwhelming number and variety of domains and application areas that are enhanced with technological advancements and their effective use to provide services to people. Be it a major tourism hub or a small community striving to become sustainable, smart city solutions have found their way in diverse areas of urban lifestyle. Demand for city solutions is anticipated to be on the rise, owing to a number of factors such as growing urban population and need to better manage limited natural resources and environmental sustainability. Rapid urbanization, aging infrastructure, and adoption of new technology, coupled with need for improved quality of life, are also driving the industry.
The market presents a diverse set of advantages, such as efficient mobility, enhanced buildings and homes, optimum energy utilization, and better administrative services.Growing adoption of novel technologies that complement management of cities of the future is also a major catalyst in industry growth.
The market also stands to benefit from initiatives taken by national and regional governments, residents, and local businesses to implement projects and tend toward cities' problems.
The smart cities market encompasses myriad sectors such as healthcare, transport, water, assisted living, security, and energy and their implementation varies from city to city due to technological penetration in a specified region.The high amount of initial financial investments, need for consolidation of different departments and sectors, and lack of a systemic approach may have a negative impact on industry growth.
Yet, the market is anticipated to grow at a rapid rate in the coming years, driven by industries' renewed interest, availability of technology, and all-inclusive participation of industry stakeholders.
Further key findings from the study suggest:
- Communication infrastructure and web-based services are anticipated to play a major role in the industry's stride toward global adoption. Inevitable consolidation of services, infrastructure, data, and sensors will help in the creation of truly smart cities of the future
- Major hindrances in the adoption and implementation of these technologies include concerns regarding privacy and security of data
- Attempts have also been made at developing consortiums to support and standardize the smart city market. However, this has been limited to certain regions and application areas due to lack of a systemic approach
- The industry is witnessing different forms of investment scenarios, such as Build Operate Transfer (BOT), Build Operate Manage (BOM), and Build Operate Own (BOO), which are gaining traction as major financial funding measures for smart cities. The BOM model for investment and management is gaining popularity due to ease of operation and a combined control over infrastructure that it offers to interested parties
- Key industry participants include ABB Limited; Accenture; Cisco Systems, Inc.; Schneider Electric SE; Siemens AG; IBM Corporation; and Microsoft Corporation. Other prominent players include Hitachi, Ltd.; Honeywell International Inc.; Intel Corporation; Oracle Corporation; and Huawei Technologies Co. Ltd. The industry is marked with growing number of collaborations between governments and companies to develop and implement pilot projects.
About Reportbuyer
Reportbuyer is a leading industry intelligence solution that provides all market research reports from top publishers.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
09/12/2025 | Marcy LaRont, I-Connect007We may be post-Labor Day, but it is still hot-hot-hot here in the great state of Arizona—much like our news cycles, which have continued to snap, crackle, and pop with eye-raising headlines over this past week. In broader global tech news this week, AI and tariff-type restrictions continues to dominate with NVIDIA raising its voice against U.S. lawmakers pushing chip restrictions, ASML investing in a Dutch AI start-up company to the tune of $1.5 billion, and the UAE joining the ranks of the U.S. and China in embracing “open source” with their technology in hopes of accelerating their AI position.
IPS, SEL Raise the Bar for ENIG Automation in North America
09/11/2025 | Mike Brask, IPSIPS has installed a state-of-the-art automated ENIG plating line at Schweitzer Engineering Laboratories’ PCB facility in Moscow, Idaho. The 81-foot, fully enclosed line sets a new standard for automation, safety, and efficiency in North American PCB manufacturing and represents one of the largest fully enclosed final finish lines in operation.
Dan Feinberg on Walt Custer: Remembering an Extraordinary Business Associate and Friend
09/09/2025 | Dan Feinberg, Technology Editor, I-Connect007The passing of Walt Custer marks the end of an era for all those who knew him and were helped and impressed by his presence, both personally and professionally. Walt's life was characterized by his unwavering commitment to the industry, his profound wisdom and willingness to share it, and his infectious enthusiasm for everything he did.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
09/05/2025 | Andy Shaughnessy, I-Connect007It’s almost fall here in Atlanta, and that means that the temperature is finally dropping. And it quit raining! It’s been raining since March, and I’m so over it, as the social influencers say. Last night we grilled out on the deck, and it wasn’t hot, and we didn’t get rained on. Life is good. It was a busy week in the industry. In this installment of my must-reads, we say goodbye to Walt Custer, the man who made PCB data points interesting for the rest of us.
UHDI Fundamentals: UHDI Technology and Industry 4.0
09/03/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in the context of Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. Here, I’ll explore the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.