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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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GlobalFoundries Launches Advanced Facilities Control Centre in Singapore

10/26/2026 | GlobalFoundries
GlobalFoundries opened its Advanced Facilities Control Centre (AFCC) at its Singapore site, advancing the company’s leadership in digitally-enabled semiconductor manufacturing.

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Global Electronics Association's ADEPT Council Deepens Taiwan Presence as First Satellite Council Holds Inaugural In-Person Meeting

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The Global Electronics Association's Advanced Electronic Packaging Technology (ADEPT) Leadership Council is deepening its presence in Taiwan.

HDP, Global Electronics Association Release New Copper Foil Profile Test Method

10/19/2026 | HDP User Group
High Density Packaging User Group (HDP) and the Global Electronics Association are pleased to announce the release of a new test method, IPC-TM-650-2.2.23, based on the results of HDP’s Non-Contact Copper Foil Profile project.

GlobalFoundries Marks Dresden Expansion, Unveils Physical AI Platform

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GlobalFoundries celebrated the topping-out of its SPRINT expansion project in Dresden and announced FDX Fusion, a next-generation platform for highly integrated, energy-efficient chips planned for development and manufacturing at the site.
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