The Right Approach: Get Ready for ISO 9001 Version 6
Dan’s Biz Bookshelf: ‘Still Broke: Walmart’s Remarkable Transformation'
Driving Innovation: Depth Routing Processes—Achieving Unparalleled Precision in Complex PCBs
Orange Co. Designers Council Meeting July 18
July 3, 2019 | Scott McCurdy, Freedom CAD ServicesEstimated reading time: 1 minute
The Orange County Chapter of the IPC Designers Council will hold a “Lunch ‘n’ Learn” meeting on July 18 at JT Schmid’s Restaurant & Brewery in Anaheim.
The special guest speaker will be Julie Ellis, field application engineer with TTM. Julie will present “How Fabrication Processes Determine DFM Guidelines: A detailed look at fabrication realities to help you understand capabilities and trade-offs.”
PCB designers struggle with many challenges when planning a layout, as many factors in the fabrication process must be considered. Board shops must constantly invest in equipment and process technologies to improve their manufacturing yields as complexity grows.
Julie’s presentation will help attendees design a better PCB through a deeper understanding of major processes demonstrated in PCB101. For example, design rules are different for mechanically drilled vs. laser drilled holes, and using laser drill pad diameters for through-hole requirements may kill your project in production.
Julie will define key fabricator concerns caused by the interplay between material and process tolerances and how they stack up. The end results are minimum DFM guidelines that will generate the highest yields at the fabricator. Each fabricator’s site guidelines are established based on their unique equipment sets. The equipment sets are selected to support different technologies ranging from heavy Cu to microBGA designs.
At the end of this presentation, attendees will understand why different fab facilities have different capabilities, as well as how to identify and apply the correct design guidelines related to registration, aspect ratio and annular ring for mechanical through-hole vs. microvia blind hole, etching, plated layer vs. non-plated layer finished Cu thickness, and VIPPO (via-in-pad, plated over).
Location
JT Schmid’s Restaurant & Brewery, in the Reagan Room
2610 E. Katella Ave.
Anaheim, California 92806
(Across from the Honda Center)
Cost
The cost to attend this “Lunch ‘n’ Learn” event is $15 at the door. We are pleased to have Altium’s sponsorship to help us with the cost of the luncheon. Please RSVP no later than noon on Wednesday, July 17, so we can get a good headcount.
There are two ways to RSVP:
- Click here to RSVP
- Or email your RSVP
Thank you!
Scott McCurdy
President, IPC Designers Council, Orange County Chapter
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Deca, Silicon Storage Technology Announce Strategic Collaboration to Enable NVM Chiplet Solutions
09/11/2025 | Microchip Technology Inc.As traditional monolithic chip designs grow in complexity and increase in cost, the interest and adoption of chiplet technology in the semiconductor industry also increases.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).
Global Citizenship: Together for a Perfect PCB Solution
09/10/2025 | Tom Yang -- Column: Global CitizenshipIf there’s one thing we’ve learned in the past few decades of electronics evolution, it’s that no region has a monopoly on excellence. Whether it’s materials science breakthroughs in Europe, manufacturing efficiencies in China, or design innovations in Silicon Valley, the PCB industry thrives on collaboration.
The Shaughnessy Report: Winning the Signal Integrity Battle
09/09/2025 | Andy Shaughnessy -- Column: The Shaughnessy ReportWhen I first started covering this industry in 1999, signal integrity was the hip new thing in PCB design. Conference classes on signal integrity were packed to the walls, and an SI article was guaranteed to get a lot of reads.
The Signal Integrity Issue: Design007 Magazine September 2025
09/09/2025 | I-Connect007 Editorial TeamAs the saying goes, “If you don’t have signal integrity problems now, you will eventually.” This month, our experts share a variety of design techniques that can help PCB designers and design engineers achieve signal integrity.