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NPL Webinar Update: Effect of Bias CAF Failures of Electronic Circuits
July 8, 2019 | NPLEstimated reading time: Less than a minute
Achieving high reliability in service is the key issue in today's high-density electronic circuits. The voltage applied to the electronic circuit plays a very important role in electrochemical reliability. And insulation resistance (IR) measurement has been widely used to predict and evaluate the reliability of electronic circuit.
The test voltages for existing IR measurement are only up to 300 V. Trends for more electric vehicles mean that the measurements need to be conducted at significantly increased voltages to understand potential new failure mechanism when using voltages up to 1000 V.
Conductive anodic filament (CAF) formation inside PCBs is an important failure of the electronic circuit. Special designed PCBs with CAF patterns of different via to via distances will be tested at different voltages up to 1000 V. The relationship between via to via distance and test voltage of CAF failure will also be investigated.
In line with this, the National Physical Laboratory will hold a webinar on July 16, 2019, 6:30 a.m. - 8:00 a.m. PDT, to help the industry understand the effect of bias (up to 1,000V) on conductive anodic filament (CAF) failures of electronic circuits.
Find out more in NPL’s webinar. To register, click here.
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