Driving Innovation: Depth Routing Processes—Achieving Unparalleled Precision in Complex PCBs
It's Only Common Sense: The Evolution of Prospecting
Dan's Biz Bookshelf: 'Apple in China: The Capture of the World’s Greatest Company'
Meet the Author Podcast: Martyn Gaudion Unpacks the Secrets of High-Speed PCB Design
July 16, 2025 | I-Connect007Estimated reading time: 1 minute
In this special Meet the Author episode of the On the Line with… podcast, Nolan Johnson sits down with Martyn Gaudion, signal integrity expert, managing director of Polar Instruments, and three-time author in I-Connect007’s popular The Printed Circuit Designer’s Guide to... series.
In this episode, Martyn discusses the inspiration behind his high-speed PCB design books, with a special focus on his latest release, The Printed Circuit Designer's Guide to... More Secrets of High-Speed PCBs. Gaudion explains how the evolving challenges in high-speed design inspired this latest book and how it is crafted to help engineers navigate today’s complex PCB landscape and make smarter, faster design decisions.
The episode also offers an in-depth look at Gaudion’s approach to technical writing, breaking down intricate engineering concepts into clear, practical guidance. Listeners will gain insight into the personal perspective and thoughtful process behind his books and the expertise that drives his contributions to the field.
Explore Martyn’s latest book: The Printed Circuit Designer's Guide to...More Secrets of High-Speed PCBs
Stay tuned for more On the Line with… episodes, where industry leaders share the stories behind the work shaping electronics today.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Indium Corporation to Highlight High-Reliability Solder Solutions at SMTA Guadalajara Expo
09/04/2025 | Indium CorporationIndium Corporation, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets, will feature a range of innovative, high-reliability solder products for printed circuit board assembly (PCBA) at the SMTA Guadalajara Expo and Tech Forum, to be held September 17-18 in Guadalajara, Mexico.
Beyond Design: Effective Floor Planning Strategies
08/20/2025 | Barry Olney -- Column: Beyond DesignComponent placement on a printed circuit board is more involved than simply fitting parts into available space. It plays a pivotal role in determining the board’s overall manufacturability, performance, reliability, and cost. Poor placement can compromise even the most meticulously designed PCB. Effective component placement alleviates mechanical stress, promotes efficient thermal management, and helps prevent excessive heat buildup.
Smart Automation: Pick-and-place Machines—What Matters in 2025
08/12/2025 | Josh Casper -- Column: Smart AutomationWhen people talk about placement technology, they often zero in on speed: How fast can a machine place components? What's the quoted components per hour (CPH)? How many nozzles are on the head? While these metrics matter, on most production floors, the fastest machine on paper isn’t always the most productive.
New Frontier Aerospace and Air Force Institute of Technology Sign CRADA to Advance Hypersonic VTOL Aircraft
08/05/2025 | PR NewswireNew Frontier Aerospace (NFA) is excited to announce a Collaborative Research and Development Agreement (CRADA) with the Air Force Institute of Technology (AFIT) aimed at advancing an innovative rocket-powered hypersonic Vertical Takeoff and Landing (VTOL) aircraft.
Atg Launches Latest Large Format Test System, A9XL, with 8 Heads and 48” x 26” Panel Capability
08/04/2025 | atg Luther & Maelzer GmbHatg Luther & Maelzer GmbH (a Mycronic company) is proud to roll out a new large format test system generation based on the latest high speed atg A9 (board size up to 24” x 21”) and A9L platform.