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I-Connect007 announces the release of the second episode in its new six-part podcast series, PCB Materials: The Backbone and Future of Electronics. In “5G, AI & Beyond—Designing for High-Speed Performance,” we explore how artificial intelligence is reshaping the rules of electronics design, demanding unprecedented speed, power, and high-frequency performance that push beyond the limits of traditional materials. As AI applications scale rapidly, are yesterday’s materials becoming obsolete?

Smart Automation: Preparing for an SMT Line Upgrade—Materials and Setup Verification

02/18/2026 | Josh Casper -- Column: Smart Automation
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Northrop Grumman Awarded Contracting Tool to Speed Military Microelectronics

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Teradyne, MultiLane Announce Formation of Joint Venture, MultiLane Test Products

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Lightmatter, Cadence Collaborate to Accelerate Optical Interconnect for AI Infrastructure

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