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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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Meet the Author Podcast: Martyn Gaudion Unpacks the Secrets of High-Speed PCB Design
July 10, 2025 | I-Connect007Estimated reading time: 1 minute
In this special Meet the Author episode of the On the Line with… podcast, Nolan Johnson sits down with Martyn Gaudion, signal integrity expert, managing director of Polar Instruments, and three-time author in I-Connect007’s popular The Printed Circuit Designer’s Guide to... series.
In this episode, Martyn discusses the inspiration behind his high-speed PCB design books, with a special focus on his latest release, The Printed Circuit Designer's Guide to... More Secrets of High-Speed PCBs. Gaudion explains how the evolving challenges in high-speed design inspired this latest book and how it is crafted to help engineers navigate today’s complex PCB landscape and make smarter, faster design decisions.
The episode also offers an in-depth look at Gaudion’s approach to technical writing, breaking down intricate engineering concepts into clear, practical guidance. Listeners will gain insight into the personal perspective and thoughtful process behind his books and the expertise that drives his contributions to the field.
Explore Martyn’s latest book: The Printed Circuit Designer's Guide to...More Secrets of High-Speed PCBs
Stay tuned for more On the Line with… episodes, where industry leaders share the stories behind the work shaping electronics today.
Suggested Items
Wolfspeed Stock Soars After Filing for Chapter 11 Bankruptcy
07/01/2025 | I-Connect007 Editorial TeamOn July 1, Wolfspeed shares doubled following the company’s announcement on June 30 that it had filed for Chapter 11 bankruptcy protection.
Renesas Announces Expected Loss Resulting from Signing Restructuring Support Agreement with Wolfspeed
06/27/2025 | RenesasRenesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, announced that it has entered into a Restructuring Support Agreement with Wolfspeed, Inc. and its principal creditors for the financial restructuring of Wolfspeed. As a result, Renesas expects to record a loss as described below.
Renesas Announces Expected Loss Resulting from Signing Restructuring Support Agreement with Wolfspeed
06/24/2025 | RenesasRenesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, announced that it has entered into a Restructuring Support Agreement with Wolfspeed, Inc. and its principal creditors for the financial restructuring of Wolfspeed. As a result, Renesas expects to record a loss as described below.
ACCM Joins Polar’s Speedstack Material Partner Program
06/10/2025 | Polar InstrumentsAdvance Chip & Circuit Materials has recently joined the Polar Speedstack Material Partner Program to ease the inclusion of ACCM's innovative Celeritas build up materials into the PCB supply chain.
Hon Hai Research Institute Partners with Taiwan Academic Research Institute and KAUST to Participate in CLEO 2025
05/30/2025 | FoxconnThe research team of the Semiconductor Division of Hon Hai Research Institute, together with the research teams of National Taiwan University and King Abdullah University of Science and Technology in Saudi Arabia, has successfully made breakthroughs in multi-wavelength μ -LED technology to achieve high-speed visible light communication and optical interconnection between chips.