Robotic Process Automation Deployments Prove Better Customer Experience and Higher Revenue Growth
July 10, 2019 | Frost & SullivanEstimated reading time: 2 minutes
With enterprises across industries seeking elegant, seamless, and effective solutions that will improve business processes, the global robotic process automation (RPA) market is expected to grow to more than $2 billion by 2020. Deployments in contact centers are growing strongly due to RPA’s ability to reduce costs and increase operational efficiencies. RPA-integrated contact centers can help improve the customer experience (CX) as well as the employee experience while driving revenue growth. RPA can also positively spur collaboration across business units (BUs) and enhance operational efficiencies.
Frost & Sullivan’s white paper, The Intelligent RPA Revolution with Process Discovery, presents the ways in which RPA can drive meaningful digital innovation and business outcomes in contact centers. It analyzes the value of Kryon’s Process Discovery™ solution, which streamlines the planning and implementation of automated work processes.
“Companies need to consider establishing a cross-organizational strategy when it comes to RPA,” explained Stephen Loynd, Digital Experience Global Director at Frost & Sullivan. “Enterprises need to carefully assess the situations in which automation is appropriate, the applications that are already successfully automated, and, finally, review and assess RPA initiatives across the organization on a regular basis.”
“Kryon’s Artificial Intelligence (AI)-powered full cycle RPA platform offers quick deployment of robust, scalable, and cost-efficient virtual workforces for global enterprises,” added Julie Shafiki, Chief Marketing Officer at Kryon. “Our specific approach to RPA involves identifying processes with Process Discovery, deploying automation, and leveraging smart analytics to optimize performance and achieve organization-wide processes. Kryon’s smart analytics engine provides the actionable intelligence required to fuel continuous process optimization.”
Kryon’s solution helps companies get more out of their legacy systems by automating the rekeying of data between systems. Some of the specific benefits of Kryon’s Process Discovery tool include:
- Visibility, Immediacy, Scalability: Provides insight into business processes to reveal opportunities for automation. Kryon Studio immediately generates automation workflows for each process it identifies. After a process has been automated, Kryon robots continue to gather analytics and pursue continuous process optimization over time.
- Advanced Visual Recognition: Robots collect essential data on employees’ work processes in real time and create detailed process maps about user actions.
- Software Compatibility: Offers an approach fully compatible with all types of software, due to visual recognition.
- Empowered Employees: Business users are empowered to manage an entire process in a relatively short time.
- Information Security: Robots gather information on-premise from employees’ computer screens rather than requiring third-party access to system event logs. The number of people who have access to sensitive information about processes within a company can also be limited.
- Lower Costs and Higher ROI: Lowers the costs associated with identifying processes manually or through third parties, as well as costs related to the deployment, development, and management of RPA.
- Quick Deployment: Customers glean benefits from Kryon’s RPA after a mere 3-5 weeks and discover business processes within only a few days.
About Frost & Sullivan
For over five decades, Frost & Sullivan has become world-renowned for its role in helping investors, corporate leaders and governments navigate economic changes and identify disruptive technologies, Mega Trends, new business models and companies to action, resulting in a continuous flow of growth opportunities to drive future success.
Subscribe
Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.
Subscribe now to stay informed, competitive, and connected.
Suggested Items
TLT Electronics Officially Opens Facility in Vietnam
05/06/2026 | TLT ElectronicsLithuanian EMS provider TLT Electronics has recently announced the opening of a new facility in Vietnam. For their clients, this is a chance to expand manufacturing into a second region without the headache of onboarding a new supplier. Same team, same processes, same quality standards — still TLT Manufacturing, just on another continent.
Trouble in Your Tank: In Complex Systems, Design Rules Aren’t Optional
05/06/2026 | Michael Carano -- Column: Trouble in Your TankThere is no question that the electronics industry, especially in circuit board design and fabrication, advanced packaging, and innovation throughout the value chain, has seen a significant transformation, whether it be in materials, system architecture, HDI and ultra HDI, semiconductors, or chiplets. AI and high-performance computing (HPC) are driving change across several fronts, including material properties, assembly techniques (think hybrid bonding), and power management.
Meet Emerging Engineers: Patrick Owen and Eric Mickenbecker, Summit Interconnect
05/05/2026 | Michelle Te, I-Connect007Patrick Owen and Eric Mickenbecker both work for Summit Interconnect, and are in their second year of the Global Electronics Association’s Emerging Engineer Program with mentor Brian Chislea. They stopped by the I-Connect007 booth at APEX EXPO and shared a bit of their story with me. Patrick has worked at the Hollister, California, plant since 2018, while Eric has been at the Chicago site since 2023. Like many of their peers, they came to the electronics industry from different paths, but are both excited about making an impact.
The Missing Connection: Wire Harness Quoting Joins the Digital Age
05/01/2026 | Joanne Harris, Tech-2marketingWalk the floor of a modern wire harness manufacturing facility, and the investment in technology is hard to miss. Automated wire cutting and stripping machines process thousands of cuts an hour with sub-millimeter precision. Computerized crimping presses deliver consistent, validated terminations that a hand tool never could. Laser wire markers, automated test benches, and vision-guided assembly stations represent hundreds of thousands of dollars of capital investment, all in service of building a better harness faster and more reliably than the competition.
EDADOC: Building the ‘Neural Hub’ for High-Compute Chips Within a Compact Space
04/28/2026 | ECIOEvery chip to the market must pass a stringent checkpoint before shipment known as ATE testing. Serving as the physical “neural hub” that connects test equipment worth millions of dollars with the device under test, the performance of the ATE test board directly determines the accuracy, efficiency, and final yield of chip testing. Amid the rapid rise of high-compute chips, what extreme challenges is this seemingly small circuit board facing? How is EDADOC addressing industry pain points through its one-stop “design + manufacturing” model?