DENSO and Toyota Joint Venture Aims to Accelerate R&D to Create Future Mobility
July 11, 2019 | ACN NewswireEstimated reading time: 2 minutes
DENSO Corporation and Toyota Motor Corporation today agreed to establish a joint venture for research and advanced development of next-generation, in-vehicle semiconductors. The two companies will study the details and aim to establish the new company in April 2020.
Recently, electronic controls have been increasingly implemented into vehicles. Furthermore, the number of in-vehicle semiconductors has also grown, and the performance of these semiconductors has continuously improved. To create a future of mobility that is safe and sustainable, it is necessary to develop next-generation semiconductors that are integral to technology innovations, such as connected cars, automated driving, sharing mobility and electrification.
In June 2018, DENSO and Toyota agreed to consolidate the electronic components production and development functions to DENSO. Based on this agreement, they have been working to achieve a speedy and competitive production and development system.
DENSO has decided to establish the new company for research and advanced development of in-vehicle semiconductors, and will establish a stronger system for R&D of semiconductors. DENSO has agreed to accept equity participation from Toyota for the new company to accelerate the speed of development by taking full advantage of Toyota's knowledge from a mobility viewpoint. Through equity participation in the new company, Toyota will achieve further technology innovations by introducing cutting-edge semiconductor technologies from the planning phase when developing its mobility services and vehicles.
The new company will conduct advanced research on the basic structure and processing method of next-generation semiconductors and develop electronic components by implementing semiconductors, such as power modules for electric vehicles and periphery monitoring sensors for automated vehicles, thereby contributing to creating the future of mobility.
About Denso
DENSO is a $48.3 billion global mobility supplier that develops advanced technology and components for nearly every vehicle make and model on the road today. With manufacturing at its core, DENSO invests in its 221 facilities in 35 countries to produce thermal, powertrain, mobility, electrification, & electronic systems, to create jobs that directly change how the world moves. The company's 170,000+ employees are paving the way to a mobility future that improves lives, eliminates traffic accidents, and preserves the environment. Globally headquartered in Kariya, Japan, DENSO spent 9.3% of its global consolidated sales on research and development in the fiscal year ending March 31, 2019.
About Toyota Motor Corporation
Toyota Motor Corporation (TMC) is the global mobility company that introduced the Prius hybrid-electric car in 1997 and the first mass-produced fuel cell sedan, Mirai, in 2014. Headquartered in Toyota City, Japan, Toyota has been making cars since 1937. Today, Toyota proudly employs 370,000 employees in communities around the world. Together, they build around 10 million vehicles per year in 29 countries, from mainstream cars and premium vehicles to mini-vehicles and commercial trucks, and sell them in more than 170 countries under the brands Toyota, Lexus, Daihatsu and Hino.
Subscribe
Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.
Subscribe now to stay informed, competitive, and connected.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
Global Electronics Association to Testify at the Office of the U.S. Trade Representative Panel on Section 301 Structural Excess Capacity
05/08/2026 | Global Electronics AssociationChris Mitchell, Vice President for Global Government Relations at the Global Electronics Association, will testify before the Office of the U.S. Trade Representative (USTR) Panel on Section 301 Structural Excess Capacity on Friday, May 8.
Kimball Electronics Reports Q3 Results With Double-Digit Sequential Medical Sales Growth
05/07/2026 | Kimball ElectronicsKimball Electronics, Inc. announced financial results for the third quarter ended March 31, 2026.
Hall of Fame Spotlight Series: Highlighting Karen McConnell
05/07/2026 | Dan Feinberg, I-Connect007In 2021, Karen McConnell was awarded the Raymond E. Pritchard Hall of Fame award in recognition of her contributions to the Association and the electronics industry. As a senior staff member and CAD/CAM engineer at Northrop Grumman Enterprise Services, her primary responsibility was to develop a common, shared EDM (Electronic Document Management) library to support the electrical and PCB design tool initiatives across Northrop Grumman Mission Systems.
IMI Reports Stronger Performance and Return to Profitability in 2025
05/06/2026 | IMIIntegrated Microelectronics, Inc. (IMI) reported a significantly improved performance in 2025, reflecting the positive results of its multi year transformation focused on operational efficiency, portfolio optimization, and strengthening core capabilities.