Driving Innovation: Mechanical and Optical Processes During Rigid-flex Production
It’s Only Common Sense: Your Biggest Competitor Is Complacency
The Chemical Connection: Onshoring PCB Production—Daunting but Certainly Possible
An Examination of Glass-fiber and Epoxy Interface Degradation in Printed Circuit Boards
July 12, 2019 | Bhanu Sood, Michael Osterman, and Michael Pecht, Center for Advanced Life Cycle EngineeringEstimated reading time: 9 minutes
1. Lathi, J.N., Delaney, R.H., and Hines, J.N. “The Characteristic Wear-out Process in Epoxy Glass Printed Circuits for High Density Electronic Packaging,” Reliability Physics 17th Annual Proceeding, pp. 39–43, 1979.
2. Sood, B., and Pecht, M. “Conductive filament formation in printed circuit boards: effects of reflow conditions and flame retardants,” Journal of Materials Science: Materials in Electronics, 22:1602–1615, 2011.
3. Rogers, K., Hillman, C., Pecht, M., and Nachbor, S. “Conductive Filament Formation Failure in a Printed Circuit Board,” Circuit World, Vol. 25 (3), pp. 6–8, 1999.
4. Lando, D.J., Mitchell, J.P., and Welsher, T.L. “Conductive Anodic Filaments in Reinforced Polymeric Dielectrics: Formation and Prevention,” Reliability Physics 17th Annual Proceeding, pp. 51–63, 1979.
5. Domeier, L., Davignon, J., and Newton, T. “A Survey of Moisture Absorption and Defects in PWB Materials,” Proceedings of the 1993 Fall IPC Meeting, pp. 3–5, 1993.
6. William, V. “Conductive Anodic Filament Resistant Resins,” Proceedings of the IPC Printed Circuits Expo, 2002.
7. Mack, H. “Choosing the Right Silane Adhesion Promoters for SMP Sealants,” Adhesive and Sealant Council Meeting in Orlando, Florida, 2001.
8. Rogers K. “An analytical and experimental investigation of filament formation in glass/epoxy composites,” ProQuest Dissertations and Theses, 2005.
9. Materne, T., de Buyl, F., and Witucki, G.L. “Organosilane Technology in Coating Applications: Review and Perspectives,” Dow Corning S.A. and Dow Corning Corporation, 2006.
10. Plueddemann, E. P. In Proc. ICCI-II. “Interfaces in polymer, ceramic, and metal matrix composites,” Hatsuo Ishida, Ed., pp. 17–33, 1988.
11. Hodzic, A., Kim, J. K., and Stachurski, Z. H. Polymer 42:5701-5710, 2001.
12. Gurumurthy, C. K., Kramer, E.J., and Hui, C.Y. “Hydro-Thermal Fatigue of Polymer Interfaces,” Acta Materialia, Vol. 49, pp. 3309–3320, 2001.
13. Ritter, J. E., and Huseinovic, A. “Adhesion and Reliability of Epoxy/Glass Interfaces,” Journal of Electronic Packaging, Vol. 123, pp. 401–403, 2001.
14. Leung, S.Y.Y., Lam, D.C.C., and Wong, C.P. “Experimental Investigation of Time Dependent Degradation of Coupling Agent Bonded Interfaces,” IEEE Electronic Components and Technology Conference, 2001.
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