-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
Dissecting the IPC Regional Survey on PCB Technology Trends
July 15, 2019 | I-Connect007 Editorial TeamEstimated reading time: 15 minutes
Johnson: The regional differences seem to be driven now more by the application or the market associated with the OEMs, using that region, more than raw capabilities or fabrication expertise.
Carano: Correct; that’s what the report showed, and that’s what our experience is telling us. Look at the evolution of mobile phones or the de-evolution of the desktop computer, laptop, and tablet. The application is higher computing power, but we are doing this with a different set of materials, chemistries, and technologies that are used to make the circuit boards.
It’s about three things: humans, materials, and machines. All of those things are blending together and changing how we do those things. Based on the survey results, there’s an equipment evolution. We asked the participants what equipment investments, capital expenditures, etc., that they were making. Over the last four to six years, more and more people are trying to get finer lines and spaces, and they’re getting there with laser direct imaging, new chemistry techniques, or equipment with etchers, etc. These things are being driven by functionality and reliability, and besides the application, it also involves functionality, form factor, etc.
How many angels can we get to dance on the head of the pin? Look at the folks on the semiconductor side. They start with the chip, and those I/Os are increasing, so what’s going to happen? It changes the way the board needs to be made. Happy Holden has always been involved in design and a strong proponent of HDI, and rightly so. There are all of the technological, reliability, and functionality reasons you want to be in HDI.
But you can’t get into HDI unless you have the right investments in people, materials/chemistries, and equipment. The report showed that. Just because more HDI is done in Asia in terms of volume, that technology is still here in North America; it’s very strong but concentrated in the hands of fewer fabricators as a percentage of the world.
Fritz: I had two takeaways after reading the survey results. One was that North American fabricators are more aware of what’s coming in the future, and they are doing a decent job of forecasting what they’re going to need in five years. Please remember this is called a technology survey. The other was that Asia can and does make a lot of the same stuff as North America because they produce the volume. If you have 90% of the world’s production in Asia, 5% here, and 5% in Europe, they have to make most of the stuff that we’re going to need when it turns up to big volumes.
Johnson: With these recent changes and what you found in the report, what do you see as the implications looking out the next 5–10 years?
Fritz: For me, North American shops have to stay on top of technology, and be aware that they have to make investments, pick and choose, be very sharp, and know their customer and the OEM they’re building for. In Asia, I can’t imagine that they’re not going to stay at 90% of the world production of boards, and they’ll have to make whatever is produced in volume. Currently, it’s cellphones and things like that, but automotive is a rising trend and presents a big challenge. It’s mostly Asian, but you have European and American OEMs as well, so they’re going to have to pay attention to where the OEMs are and what they need in their products. Know your customer is the bottom line.
Johnson: Thinking about automotive in particular, do you foresee, for example, Asian companies looking to manufacture PCBs in volume in other regions to get closer to the OEMs?
Fritz: I do not necessarily see that. With shipment times down low for electronics, in a matter of hours or days, you can be anywhere in the world. I wish I knew the answer to this trade problem that we’ve developed between the U.S. and China because production is not leaving Asia, but some people are hedging their bets on moving out of China to Vietnam, Thailand, or Taiwan. Right now, that’s a bigger concern of mine than manufacturing in Europe or the U.S.
Happy Holden: Especially for automotive because it has a requirement that cellphones and consumer electronics don’t—high reliability. High reliability is a real challenge. That’s why Gentex doesn’t source any of its 120 million PCBs from China. Taiwan is diversifying into Vietnam, so they’ll also be getting boards from Vietnam through Taiwan suppliers, but they’re leaving China. They’re not hurt at all by the trade negotiations because they were never going to buy from China.
Carano: Since I know Gentex as well, every one of those 120 million circuit boards that are made in Taiwan—and maybe some in the U.S.—are all assembled in the U.S. They don’t even trust the assembly of those boards to anybody else. They do it all themselves with the phenomenal circuit board assembly operation in Zeeland, Michigan. I’ve been there, and Happy worked there, so that’s how deep they think. Everything—especially the big, important stuff—is done in-house. They won’t even farm out the bare board assembly.
Holden: The investment doesn’t bother them. But automotive is strange because Europe is going to be strong in making automotive PCBs as well, and the Chinese want to get into automotive in the worst way. But they can’t break into any of Gentex’s products, for example, and frankly, they have a quality problem. We don’t have Dr. Deming anymore to come over and teach how to do it, and that’s a tough challenge for them because automotive will continue to grow—especially with the electronics going into automotive. It isn’t going to stop.
Page 2 of 4
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Driving Innovation: Selecting the Right Laser Source
04/28/2026 | Simon Khesin -- Column: Driving InnovationWhen I first joined Schmoll Maschinen, I brought experience from almost every PCB process, except for laser. As I immersed myself in laser processing, I realized why it can seem so daunting to a newcomer. The complexity arises from three intersecting factors: A vast variety of laser sources: CO2, UV-nano, green-pico, UV-pico, IR-pico, and others; a diverse range of applications: Drilling, cutting, ablation, and more; and an extensive list of materials: These have vastly different absorption rates. Choosing the right machine or laser source is rarely trivial. Even for experienced engineers, answering "Which source is best?" requires examining the business's specific goals.
Institute of Circuit Technology Spring Seminar 2026: A Bright Future in Europe
04/23/2026 | Pete Starkey, I-Connect007Through the leafy lanes and spring flowers of Warwickshire and back to Meridan, the traditional centre of England, and now officially part of the Metropolitan Borough of Solihull in the county of the West Midlands, I attended the Annual General Meeting and Spring Seminar of the Institute of Circuit Technology (ICT) on April 14. Out of the AGM came notable changes in leadership at the top of the Institute: the retirement of Mat Beadel as chair and Emma Hudson as technical director. Effective May 1, Steve Driver is the new chair, and Alun Morgan is the new technical director.
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.
Fresh PCB Concepts: Designing PCBs for Harsh Environments—Reliability Is Engineered Upstream
04/23/2026 | Team NCAB -- Column: Fresh PCB ConceptsWhen engineers hear the phrase “harsh environment,” they usually think of the extreme temperature swings, vibration and shock, pressure changes, or radiation in aerospace. However, aerospace is not the only harsh environment where electronic assemblies must survive. Automotive power electronics, downhole oil and gas tools, marine controls, rail systems, defense platforms, and industrial automation equipment all expose PCBs to environments that are equally unforgiving. The stress mechanisms may differ, but the physics does not.
Advanced Packaging for AI: Reliability Starts at the Cu/Cu/Cu Microvia Junction
04/20/2026 | Kuldip Johal, MKS' AtotechThe rapid growth of AI computing, from training clusters to inference at scale, is reshaping demand across the entire electronics supply chain. Advances in technology requirements, such as higher bandwidth, lower latency, and greater compute density, are driving the development of advanced packaging technologies and transforming the PCB industry across design, manufacturing, testing, and even architecture.