The Right Approach: Get Ready for ISO 9001 Version 6
Dan’s Biz Bookshelf: ‘Still Broke: Walmart’s Remarkable Transformation'
Driving Innovation: Depth Routing Processes—Achieving Unparalleled Precision in Complex PCBs
AIM Summer Academy 2019
July 15, 2019 | AIM Photonics InstituteEstimated reading time: Less than a minute
The AIM Photonics Academy—the educational initiative of the AIM Photonics Institute—will be holding a one-week intensive program on integrated photonics, including:
- Fundamentals track: a crash course on state-of-the-art devices, process flow, fabless photonics circuit design, design for manufacturing, application systems, and chip packaging and test.
- Applied track: practice workshops with leading commercial software tools for modeling, simulation, layout and error check of photonics integrated circuits (PICs); short courses in application systems, and chip packaging and test.
- Student teams: work on a conceptual study of a PIC solution for an application-specific system.
- Education track: includes a roster of instructors from MIT, RIT, University of Rochester, Dartmouth College, Columbia University, University of Delaware, Finisar, Synopsys, Lumerical, and Mentor.
The AIM Summer Academy 2019 will be held from July 22–26 at the Massachusetts Institute of Technology (MIT) campus.
A limited number of academic discounts are available upon request.
For more information, visit https://bit.ly/2Y84RFr.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Deca, Silicon Storage Technology Announce Strategic Collaboration to Enable NVM Chiplet Solutions
09/11/2025 | Microchip Technology Inc.As traditional monolithic chip designs grow in complexity and increase in cost, the interest and adoption of chiplet technology in the semiconductor industry also increases.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).
Global Citizenship: Together for a Perfect PCB Solution
09/10/2025 | Tom Yang -- Column: Global CitizenshipIf there’s one thing we’ve learned in the past few decades of electronics evolution, it’s that no region has a monopoly on excellence. Whether it’s materials science breakthroughs in Europe, manufacturing efficiencies in China, or design innovations in Silicon Valley, the PCB industry thrives on collaboration.
The Shaughnessy Report: Winning the Signal Integrity Battle
09/09/2025 | Andy Shaughnessy -- Column: The Shaughnessy ReportWhen I first started covering this industry in 1999, signal integrity was the hip new thing in PCB design. Conference classes on signal integrity were packed to the walls, and an SI article was guaranteed to get a lot of reads.
The Signal Integrity Issue: Design007 Magazine September 2025
09/09/2025 | I-Connect007 Editorial TeamAs the saying goes, “If you don’t have signal integrity problems now, you will eventually.” This month, our experts share a variety of design techniques that can help PCB designers and design engineers achieve signal integrity.