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Current IssueAdvancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
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AIM Summer Academy 2019
July 15, 2019 | AIM Photonics InstituteEstimated reading time: Less than a minute
The AIM Photonics Academy—the educational initiative of the AIM Photonics Institute—will be holding a one-week intensive program on integrated photonics, including:
- Fundamentals track: a crash course on state-of-the-art devices, process flow, fabless photonics circuit design, design for manufacturing, application systems, and chip packaging and test.
- Applied track: practice workshops with leading commercial software tools for modeling, simulation, layout and error check of photonics integrated circuits (PICs); short courses in application systems, and chip packaging and test.
- Student teams: work on a conceptual study of a PIC solution for an application-specific system.
- Education track: includes a roster of instructors from MIT, RIT, University of Rochester, Dartmouth College, Columbia University, University of Delaware, Finisar, Synopsys, Lumerical, and Mentor.
The AIM Summer Academy 2019 will be held from July 22–26 at the Massachusetts Institute of Technology (MIT) campus.
A limited number of academic discounts are available upon request.
For more information, visit https://bit.ly/2Y84RFr.
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Brent Fischthal - Koh YoungSuggested Items
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Elementary Mr. Watson: Chasing Checkmarks, Not Signal Integrity
10/01/2025 | John Watson -- Column: Elementary, Mr. WatsonFor the September 2025 issue of Design007 Magazine on signal integrity, I explored how the PCB is similar to a military obstacle course: walls that sap energy like impedance mismatches, barbed wire that cuts like crosstalk, and mud pits that drag a signal down like attenuation. The takeaway was clear that a PCB is not a flat drawing; it's an electromagnetic ecosystem filled with hazards that test every signal that dares to cross it. The real danger lies not in the obstacles themselves, but in the fact that many designers never see them.
Target Condition: Rethinking the PCB Stackup Recipe
10/01/2025 | Kelly Dack -- Column: Target ConditionMarie Antoinette is attributed with saying, “Let them eat cake,” but historians now agree she likely never said it. It was probably revolutionary propaganda to paint her as out of touch with the starving masses. Yet, the phrase still lingers, and oddly enough, it applies to the world of PCB design.
Siemens, ASE Collaborate on Workflows for ASE’s VIPack Advanced Packaging Platform
09/25/2025 | SiemensSiemens Digital Industries Software announced that it is collaborating with Advanced Semiconductor Engineering, Inc. (ASE), the leading global provider of semiconductor manufacturing services in assembly and test, to develop 3Dblox-based workflows for the ASE VIPack™ platform using Siemens’ Innovator3D IC™ solution, which is fully certified for the 3Dblox standard..
Cadence, TSMC Team on AI-Driven Flows and IP for Advanced Nodes, 3DFabric
09/25/2025 | BUSINESS WIRECadence announced major advancements in chip design automation and IP, driven by its long-standing relationship with TSMC to develop advanced design infrastructure and accelerate time to market, for AI and HPC customer applications.