-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
GOEPEL electronic Expands Sales and Services in UK and Ireland
July 16, 2019 | GOEPEL ElectronicEstimated reading time: 1 minute

The Cambridge-based GOEPEL electronics Ltd. has added a new technical sales engineer. Mark Daglish is now responsible for the company’s product ranges of embedded JTAG Solutions equipment as well as inspection solutions such as automated optical inspection (AOI), automated x-ray inspection (AXI) and solder paste inspection (SPI) systems.
Daglish is an electronics test engineer with more than 40 years’ experience in the electronics industry. He has come from GE Aviation Systems, where he was responsible for PCB assembly DfT analysis and boundary scan test development. Previous rolls have encompassed the implementation of ICT and functional board test packages whilst the roll of customer project manager at SPEA UK provided detailed insight into the application of roving probe test solutions. He is a specialist in PCB assembly test strategy selection and the integration of Embedded JTAG Solutions. Furthermore, Mark Daglish will be responsible for sales of AOI/AXI/SPI systems, addressing a hugely challenging electronics production market in the British and Irish isles.
“Joining the GOEPEL team is a truly inspiring opportunity. GOEPEL understand the challenges presented by modern electronics assembly and provide class leading solutions to address these challenges. Efficient and effective test strategies need to cover the entire defect spectrum obtaining coverage from all test operations. The GOEPEL tool range delivers throughout the PCB assembly process from 3D optical and x-ray inspection through to the structural and functional performance test made possible with embedded JTAG solutions. It’s an exciting time to be a test engineer,” said Daglish.
GOEPEL electronic is a leading provider of innovative test and inspection solutions for printed circuit board assemblies (PCBAs) and electronic devices and systems. The company is divided into four divisions:
- Automotive Test Solutions
- Embedded JTAG Solutions
- Industrial Function Test
- Inspection Solutions AOI•AXI•SPI•IVS
For more information visit www.goepel.com.
Suggested Items
Koh Young Installs 24,000th Inspection System at Top 20 EMS
05/14/2025 | Koh YoungKoh Young, the global leader in True 3D measurement-based inspection and metrology solutions, proudly announces the installation of its 24,000th inspection system at a Top 20 Global EMS in Thailand.
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.