Physicists Find First Possible 3D Quantum Spin Liquid
July 23, 2019 | Rice UniversityEstimated reading time: 5 minutes
There’s no known way to prove a three-dimensional “quantum spin liquid” exists, so Rice University physicists and their collaborators did the next best thing: They showed their single crystals of cerium zirconium pyrochlore had the right stuff to qualify as the first possible 3D version of the long-sought state of matter.
Despite the name, a quantum spin liquid is a solid material in which the weird property of quantum mechanics—entanglement—ensures a liquidlike magnetic state.
In a paper this week in Nature Physics, researchers offered a host of experimental evidence—including crucial neutron-scattering experiments at Oak Ridge National Laboratory (ORNL) and muon spin relaxation experiments at Switzerland’s Paul Scherrer Institute (PSI)—to support their case that cerium zirconium pyrochlore, in its single-crystal form, is the first material that qualifies as a 3D quantum spin liquid.
“A quantum spin liquid is something that scientists define based on what you don’t see,” said Rice’s Pengcheng Dai, corresponding author of the study and a member of Rice’s Center for Quantum Materials (RCQM). “You don’t see long-range order in the arrangement of spins. You don’t see disorder. And various other things. It’s not this. It’s not that. There’s no conclusive positive identification.”
The research team’s samples are believed to be the first of their kind: Pyrochlores because of their 2-to-2-to-7 ratio of cerium, zirconium and oxygen, and single crystals because the atoms inside them are arranged in a continuous, unbroken lattice.
“We’ve done every experiment that we could think of on this compound,” Dai said. “(Study co-author) Emilia Morosan‘s group at Rice did heat capacity work to show that the material undergoes no phase transition down to 50 millikelvin. We did very careful crystallography to show there is no disorder in the crystal. We did muon spin relaxation experiments that demonstrated an absence of long-range magnetic order down to 20 millikelvin, and we did diffraction experiments that showed the sample has no oxygen vacancy or other known defects. Finally, we did inelastic neutron scattering that showed the presence of a spin-excitation continuum — which may be a quantum spin liquid hallmark — down to 35 millikelvin.”
Dai, a professor of physics and astronomy, credited the success of the study to his colleagues, notably co-lead authors Bin Gao and Tong Chen and co-author David Tam. Gao, a Rice postdoctoral research associate, created the single-crystal samples in a laser floating zone furnace at the lab of Rutgers University co-author Sang-Wook Cheong. Tong, a Rice Ph.D. student, helped Bin perform experiments at ORNL that produced a spin excitation continuum indicative of the presence of spin entanglement that produces short-range order, and Tam, also a Rice Ph.D. student, led muon spin rotation experiments at PSI.
Despite the team’s effort, Dai said it is impossible to definitively say cerium-zirconium 227 is a spin liquid, partly because physicists haven’t yet agreed on what experimental proof is necessary to make the declaration, and partly because the definition of a quantum spin liquid is a state that exists at absolute zero temperature, an ideal beyond the reach of any experiment.
Quantum spin liquids are believed to occur in solid materials that are composed of magnetic atoms in particular crystalline arrangements. The inherent property of electrons that leads to magnetism is spin, and electron spins can only point up or down. In most materials, spins are shuffled at random like a deck of cards, but magnetic materials are different. In the magnets on refrigerators and inside MRI machines, spins sense their neighbors and arrange themselves collectively in one direction. Physicists call this “long-range ferromagnetic order,” and another important example of long-range magnetic order is antiferromagnetism, where spins collectively arrange in a repeating, up-down, up-down pattern.
Page 1 of 2
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Sealed for Survival: Potting Electronics for the Toughest Environments
10/29/2025 | Beth Massey, MacDermid Alpha Electronics SolutionsElectronics deployed in harsh conditions face relentless threats from vibration, impact, chemical contaminants, airborne pollutants, and moisture, conditions that can quickly lead to failure without robust protection. Potting, the process of encapsulating electronics in a protective polymer, is a widely used strategy to safeguard devices from both environmental and mechanical hazards.
Driving Innovation: Mechanical and Optical Processes During Rigid-flex Production
10/28/2025 | Kurt Palmer -- Column: Driving InnovationRigid-flex printed circuit boards are a highly effective solution for placing complex circuitry in tight, three-dimensional spaces. They are now indispensable across a range of industries, from medical devices and aerospace to advanced consumer electronics, helping designers make the most efficient use of available space. However, their unique construction—combining rigid and flexible materials—presents a fundamental challenge for PCB manufacturers.
SMTAI 2025 Review: Reflecting on a Pragmatic and Forward-looking Industry
10/27/2025 | Marcy LaRont, I-Connect007Leaving the show floor on the final afternoon of SMTA International last week in Rosemont, Illinois, it was clear that the show remains a grounded, technically driven event that delivers a solid program, good networking, and an easy space to commune with industry colleagues and meet with customers.
ITW EAE Despatch Ovens Now Support ASTM 5423 Testing
10/15/2025 | ITW EAEAs the demand for high-performance electrical insulation materials continues to grow—driven by the rapid expansion of electric vehicles (EVs) and energy storage systems—thermal processing has become a critical step in material development.
Beyond Thermal Conductivity: Exploring Polymer-based TIM Strategies for High-power-density Electronics
10/13/2025 | Padmanabha Shakthivelu and Nico Bruijnis, MacDermid Alpha Electronics SolutionsAs power density and thermal loads continue to increase, effective thermal management becomes increasingly important. Rapid and efficient heat transfer from power semiconductor chip packages is essential for achieving optimal performance and ensuring long-term reliability of temperature-sensitive components. This is particularly crucial in power systems that support advanced applications such as green energy generation, electric vehicles, aerospace, and defense, along with high-speed computing for data centers and artificial intelligence (AI).