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Conecsus to Exhibit at SMTA Queretaro Expo & Tech Forum
July 24, 2019 | ConecsusEstimated reading time: 1 minute
Conecsus, LLC will exhibit at the SMTA Queretaro Expo & Tech Forum on Thursday, August 15, 2019. The show and conference will be held at the Misión Grand Juriquilla, Queretaro, Blvd Villas Del Meson 56 Juriquilla, QR 76230 Mexico. Registration for the show, plus the technical sessions and lunch, are all free to attendees. Exhibit Hours are 11:00 a.m.-6:00 p.m.
Conecsus representative Roberto G. Valenzuela Camargo will illustrate how the company processes wastes containing primarily tin, tin-zinc, lead, silver, gold, and copper, and converts them into usable metal products, paying its customers back for their metals waste. Conecsus is an ISO 14001 EMS certified recycling company and a refiner of SMT solder/solder paste wastes and residues.
About Conecsus
Founded in 1980, Conecsus, LLC is a sophisticated ‘green’ recycler and refiner of SMT solder/solder paste wastes and residues, as well as tin, tin-zinc, lead, silver, gold, and copper from a variety of manufacturing industries. Located in Terrell, Texas, USA, Conecsus converts these wastes into usable metal products. Conecsus’ mission is to provide innovative and high-quality industrial byproducts management, metal recovery, and recycling options that provide world-class value and service to our customers, and display respect and stewardship toward the environment. For more information, visit www.conecsusllc.com.
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Sweeney Ng - CEE PCBSuggested Items
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On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.