-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueAdvancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Indium to Showcase Sustainable Solder Paste and Alloy Technologies at Detroit Battery Show
October 3, 2025 | Indium CorporationEstimated reading time: 2 minutes
Indium Corporation, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, automotive, electric vehicle (EV), thin-film, and thermal management markets, will feature a range of sustainable, high-reliability solder products at The Battery Show North America, to be held October 7-9 in Detroit, Michigan.
Indium Corporation’s innovative solder and alloy technologies are designed to meet the stringent requirements of the EV market, where thermal management, reliability, and energy efficiency are paramount. The ability to enhance thermal cycling performance and reduce energy consumption aligns with the industry’s drive towards sustainability and longer-lasting products.
The company will showcase the following among its featured products:
Rel-ion™ Products
- Durafuse® LT is a solder paste alloy system with versatile characteristics that enable energy savings, high reliability, and low-temperature step soldering. It is ideal for assemblies with large temperature gradients and large BGAs with complex warpage profiles. Durafuse® LT delivers superior thermal cycling and drop shock performance, outperforming conventional low-temperature solders like BiSn or BiSnAg alloys, and it even outperforms SAC305 with optimal process setup.
- Indium8.9HF is an industry-proven solder paste series that delivers no-clean, halogen-free solutions designed to achieve high surface insulation resistance (SIR) and improve stability during the printing process for high-reliability automotive electronics.
- InFORMS® are reinforced solder preforms that improve mechanical strength and produce consistent bondline thickness for superior reliability performance compared to traditional solder preforms, particularly in power module applications.
- Heat-Spring® is a compressible, non-reflow metal TIM ideal for TIM2 applications. These indium-containing TIMs offer superior thermal conductivity over non-metals, with pure indium metal delivering 86W/mK in all planes. Because of its solid metal state, Heat-Spring® avoids pump-out and bake-out problems. It also offers a sustainable solution due to the company’s indium reclaim and recycle program.
Sintering Paste
- InFORCE® pressure sinter pastes are high-metal, low-organic content sinter materials available in both silver and copper. The benefits of a low-organic content composition include short drying for increased throughput and less volume reduction between wet and post-sintered deposits, meaning less paste can be used.
- InFORCE®29 is a range of pressure Cu sinter pastes for applications where high reliability and high thermal conductivity are critical. Applications for InFORCE®29 include die-attach for Si and SiC power devices and substrate-attach of power modules directly to coolers.
- InBAKE™29 Cu sinter paste is developed for high-power die-attach applications and for applications requiring high thermal conductivity, high electrical conductivity, and high service/operating temperature. InBAKE™29 can be sintered either pressureless or with pressure, under low oxygen atmospheres of O2 <500ppm. After 4,500 cycles TCT
- (-40°C–175°C), the die shear strength increases compared to time zero. Target applications include high-power die-attach (SiC MOSFET and Si IGBT), RF die-attach, and power LED die-attach.
A key element of Indium Corporation’s innovation is the company’s Formic Acid Soldering Technology (FAST), which enables high-reliability, flux-free soldering solutions tailored to next-generation power electronics.
To learn more about Indium Corporation’s solutions for EV and automotive applications, visit our experts at booth 1530 at The Battery Show North America.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Indium Features Next-Generation Materials for Semiconductor Assembly at IMAPS
09/29/2025 | Indium CorporationIndium Corporation, an industry leader in innovative materials solutions for semiconductor packaging and assembly, will feature its lineup of high-reliability products at the International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS), to be held from September 29 to October 2 in San Diego, California.
Orbit International’s Power Group Receives Two Contract Awards Totaling Approximately $1,500,000
09/29/2025 | Globe NewswireOrbit International Corp., an electronics manufacturer and software solution provider, announced that its Power Group (OPG) received two contract awards totaling approximately $1,500,000.
Empower Sets New Benchmark with 20x Faster Response and Breakthrough Sustainability Demonstrated at OCP Global Summit 2025
09/25/2025 | Empower SemiconductorEmpower Semiconductor, the world leader in powering AI-class processors, announced that its Crescendo chipset, an artificial intelligence (AI) and high-performance computing (HPC) processor true vertical power delivery platform, is available now for final sampling, with mass production slated for late 2025.
Aismalibar North America Showcases Advanced Thermal Management Solutions at The Battery Show North America 2025
09/18/2025 | AismalibarAismalibar North America, a leader in high-performance thermal management solutions, will present its latest innovations at The Battery Show North America and Electric & Hybrid Vehicle Technology Expo 2025 in Detroit, Michigan, October 6–9, 2025, where attendees can meet the team at Booth #5929 to explore materials engineered for demanding EV and high-power electronics.
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.