Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
MacDermid Alpha Launches ALPHA HiTech Series of Underfills, Cornerfills, and Low Temperature Adhesives for High Reliability Electronics
August 8, 2019 | MacDermid Alpha Electronics SolutionsEstimated reading time: 1 minute
MacDermid Alpha Electronics Solutions, leaders in soldering and bonding technologies, has launched the ALPHA HiTech series of underfills, cornerfills, and low temperature adhesives for increased reliability of assembled electronic packages.
“We are pleased to extend our HiTech portfolio to include our underfills, cornerfills, and low-temperature adhesives,” said Jimmy Shu, director of Marketing for Asia-Pacific. “Joining the SMD and UV adhesives, plus the encapsulant products we launched in April, MacDermid Alpha now supports a full suite of HiTech surface mount attachment materials. Through our experience in high volume production, these materials reduce scale-up risk for component assemblies deployed into demanding applications.”
ALPHA HiTech low temperature adhesives are one component, halogen-free, heat-cured formulations supporting processing as low as 80°C. Originally designed for sensitive smartphone camera modules, the products demonstrated proven performance in ultra-high volume. Now, many other temperature sensitive components will benefit from the ease of application and mechanical performance of these high-performance materials. HiTech adhesives exhibit optimal adhesion, drop-impact performance, and compatibility with a variety of metal and plastic surfaces. Experience and proven value/performance metrics make HiTech the low-risk option for low- temperature attachment.
ALPHA HiTech Underfills are dispensed along edges of BGA, CSP, or flip chip devices, flowing to perfectly fill the device footprint. The one-component, halogen-free, no-filler epoxies provide superior drop-shock, impact bend, and thermal cycle test performance for the most demanding component designs.
The selection of products, balancing viscosity, preheat, reworkability, and mechanical strength properties, allows users to perfectly match a HiTech underfill with specific device needs, optimizing high throughput assembly.
ALPHA HiTech Cornerfills provide mechanical anchors to device corners to allow increased reliability when a full underfill is not needed. Stable material properties assure controlled flow to prevent contact with BGA spheres, while enabling strength and flexibility for use in graphics cards, mobile computing, automotive, and medical applications.
Outperforming competitive offerings, HiTech cornerfills maintain extremely predictable viscosity even after extended staging and temperature fluctuations. The one-component, halogen-free epoxy formulations well-exceed industry mechanical thermal cycling standards.
For more information on the full ALPHA HiTech portfolio, visit macdermidalpha.com.
Share on:
Suggested Items
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
KOKI Expands U.S. Sales Coverage with Multiple New Representatives
04/29/2025 | KOKIKOKI, a global leader in advanced soldering materials and process optimization services, is pleased to announce the expansion of its U.S. sales network with the addition of three new manufacturers’ representative firms: Assembled Product Specialists, Diversitech Reps Inc., and Eagle Electronics.
SMTA Bridging the Skills Gap in Arizona
04/24/2025 | Marcy LaRont, I-Connect007One area where SMTA really excels is through its local chapters. On April 16, 2025, I-Connect007's Marcy LaRont attended the Workforce Breakfast during the SMTA Arizona Expo & Tech Forum in Mesa, which featured more than 50 electronics professionals from the local area, including defense OEMs, and others who were attending for the first time. Blackfox and Hyrel Technologies sponsored the event. The keynote presentation featured Sean Denny, a professor at Estrella Mountain Community College, who emphasized a clear need for skilled hand soldering technicians.
IPC Releases Version 2.0 of IPC-2591, Connected Factory Exchange, with Expanded Device Coverage and Smarter Data
04/23/2025 | IPCIPC announces the release of IPC-2591, Connected Factory Exchange (CFX), Version 2.0, the global standard for plug-and-play, machine-to-machine, and machine-to-system communication for digital manufacturing.