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ZESTRON Announces New Reliability and Solutions Service for Risk Assessment & Mitigation of Electronic Assemblies

05/06/2025 | ZESTRON
ZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions, is thrilled to introduce its new Reliability and Solutions (R&S) service.

Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics

05/07/2025 | Nash Bell -- Column: Knocking Down the Bone Pile
In electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.

Happy’s Tech Talk #38: Novel Metallization for UHDI

05/07/2025 | Happy Holden -- Column: Happy’s Tech Talk
I have been involved in high-density electronics substrates since 1970 when I joined Hewlett-Packard’s RF semiconductor group after college. Figure 1 shows the difference between trace/space lithography for substrates and silicon starting in 1970. My projects involved sapphire circuits for RF devices, but the figure displays the state of PCBs and integrated CMOS circuits and their packaging, not discreet RF devices. Even then, semiconductors were 50X higher density.

Elma’s AI Optimized CompacFrame Speeds Development of Rugged GPU-focused Applications

05/05/2025 | Elma Electronic
Elma Electronic has expanded its line of SOSA aligned CompacFrame development chassis to include an AI (artificial intelligence) optimized 7-slot version.

KYZEN to Spotlight Stencil Cleaning Solutions at SMTA Oregon

05/02/2025 | KYZEN'
KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Oregon Expo & Tech Forum, scheduled to take place on Tuesday, May 20 at the Wingspan Event and Conference Center in Hillsboro, OR. KYZEN’s cleaning expert Jeff Deering will be on-site at the expo providing information about stencil cleaning chemistries, including KYZEN E5631J.
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