-
-
News
News Highlights
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInventing the Future with SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
IPC CEMAC 2019 Showcases Intelligent Future Driven by Data
August 30, 2019 | IPCEstimated reading time: 1 minute
More than 200 representatives from companies such as Huawei, CRRC, NASA, Foxconn, Vayo and JWI Software gathered in Shenzhen, China for IPC CEMAC 2019. This year’s theme, “Intelligent Future Driven by Data,” provided attendees insight into Industry 4.0, the Internet of Things (IoT), electronic component 3D digital design, the use of data to drive intelligent manufacturing and the demand for high quality/highly reliable products.
Peter Chiang, vice president, IPC Greater China, opened the annual members-only event, with an introduction to the implementation of Industry 4.0 and release of IPC-2591, IPC’s connected factory exchange standard. Huang Chunguang, Huawei Technologies, Co. Ltd., discussed the important role of 3D digitalization of electronics components during his presentation, “Software Defines Manufacturing, Data Drives the Future.” Luo Jiapeng, Foxconn, introduced Foxconn’s SMT Industrial Internet blueprint and framework during his presentation, “Data -- the Foundation of Intelligent Manufacturing.”
In addition, presentations were given by: Bhanu Sood, Ph.D., NASA Goddard Space Flight Center; Chen Zhiman, CRRC Times Electric; Johnsson Per Anders, JWI Software; Liu Fengshou, Vayo; and Du Yunliang, Mentor Graphics – a subsidiary of Siemens. The event provided ample time for professionals from various industries including aerospace, railway, telecommunication and electronics manufacturing to network with speakers.
“China accounts for up to 38 percent of the global electronics industry production capacity of nearly 2 trillion USD,” said David Bergman, IPC vice president, standards and training. “The rapidly growing Chinese electronics industry market share creates opportunities and challenges for domestic electronics-related enterprises. As a global electronics industry association, IPC is committed to the promotion of technical exchanges and providing enterprises with the latest technical standards and training to drive further development of the industry. IPC’s annual CEMAC event provides the perfect backdrop for these technical exchanges.”
Next year’s IPC CEMAC will be located in Shanghai. For more information about this event or other IPC-sponsored events in Asia Pacific, visit www.ipc.org.cn.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
LITEON Technology Reports Consolidated August Sales of NT$15.6 Billion, Up 13% M-o-M, 30% YoY
09/10/2025 | LITEON TechnologyLITEON Technology reported its August consolidated revenue of NT$15.6 billion. Thanks to the growth from power management in cloud computing, advanced server, and networking, the revenue is up 13% M-o-M, 30% Y-o-Y.
MacDermid Alpha Presents at SMTA New Delhi, Bangalore Chapter, on Flux–OSP Interaction
09/09/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha contributes technical insights on OSP solderability at the Bangalore Chapter, SMTA reinforcing commitment to knowledge-sharing and industry collaboration.
Elephantech Selected for NEDO’s Deep-Tech Startups Support Program in the Green Transformation field
09/09/2025 | ElephantechElephantech is pleased to announce its selection for the Demonstration development for Mass Production (DMP) phase of the 4th round of the Deep-Tech Startups Support Program in the Green Transformation field (GX) by NEDO, the New Energy and Industrial Technology Development Organization of Japan.
Ynvisible Celebrates Inauguration of New Production Facility in Norrköping, Sweden
09/09/2025 | Ynvisible Interactive Inc.Ynvisible Interactive Inc., a pioneer in sustainable and scalable e-paper display technology and printed electronics, is pleased to announce the successful inauguration of its new roll-to-roll production facility in Norrköping, Sweden – a city globally recognized as a center of excellence for Printed and Organic Electronics.
Sypris Wins Contract for Classified Missile Avionics Program
09/09/2025 | Sypris Solutions Inc.Sypris Electronics, LLC, a subsidiary of Sypris Solutions, Inc., announced that it has received a follow-on contract award to manufacture and test advanced electronic power supply modules for integration into the avionics suite of a classified, mission-critical missile program. Production is scheduled to begin in 2026.