-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueThe Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
Solder Printing
In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
IPC E-Textiles Europe 2019 to Bring Technical Education to European E-textiles Community
September 3, 2019 | IPCEstimated reading time: 2 minutes
IPC E-Textiles Europe 2019, a two-day technical education conference for innovators, technologists and brands/OEMs, will provide a platform for education and collaboration among a diverse group of professionals interested in producing e-textiles technologies and products. Developed by the e-textiles industry for the e-textiles industry, IPC E-Textiles Europe 2019 will also provide technical insights of interest to myriad market segments, including fashion design, health monitoring, medical, automotive, aerospace and military. The conference will take place in Munich, Germany, November 12-13, 2019.
Presentation highlights of the technical conference agenda include:
- Design and Fabrication Techniques of Textile-Based Embroidered RFID Tags for Apparels
- Reliability and Washability of Textile-Based Circuit Boards
- Warp Knitted Solutions for E-Textile Applications
- Conductive Patterns on Textiles by Laser Welding
- Printed Electronics—Electrifying Textiles for Smart Applications
- The New Drug Delivery frontier—Textiles
- Wearable Sensors for Your Favorite Sports
- E-Textiles as an Enabling Technology to Create More Discreet and Desirable Assistive Technology for Older Adults
- Advanced Inkjet Printed E-Textiles for Health Monitoring in Military Applications
- Design in Confidence in E-Textiles
“Smart textiles, encompassing electronics combined with textiles (e-textiles) have a very promising realm in science and technology,” said Vladan Koncar, ENSAIT, GEMTEXT, University of Lille and IPC E-Textiles Committee Europe chair. “Numerous materials, systems and devices are available for e-textiles applications, but there are challenges to making these materials, systems and devices compatible as a full e-textiles product. As a conference where scientists and people from the industry can meet and exchange experiences and knowledge, IPC E-Textiles 2019 is, therefore, tremendous."
Unique to any other e-textiles event in Europe, IPC E-Textiles Europe 2019 will also include an IPC E-Textiles Committee in Europe meeting, where participants will be able to collaborate on IPC international standards for e-textiles.
For questions about the conference or joining the IPC E-Textiles Committee in Europe meeting or any other IPC international e-textiles standards activities, visit www.ipc.org/E-Textiles-EU19.
About IPC
IPC is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 5,400 member-company sites which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Brussels, Belgium; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.
Suggested Items
PCB Design Software Market Expected to Hit $9.2B by 2031
11/21/2024 | openPRThis report provides an overview of the PCB design software market, detailing key market drivers, challenges, technological advancements, regional dynamics, and future trends. With a projected compound annual growth rate (CAGR) of 13.4% from 2024 to 2031, the market is expected to grow from USD 3.9 billion in 2024 to USD 9.2 billion by 2031.
IPC Issues Clarion Call for EU to Reclaim Leadership in Electronics Manufacturing
11/21/2024 | IPCIPC released a synopsis of its recent white paper, Securing the European Union’s Electronics Ecosystem. This condensed document presents a comprehensive overview of the current challenges in Europe’s electronics manufacturing industry and shares actionable steps to help the EU achieve a stronger, more autonomous ecosystem.
IPC Celebrates National Apprenticeship Week with a Focus on Electronics Manufacturing Excellence
11/19/2024 | IPCIPC, a leading global electronics industry association and source for industry standards, training and advocacy, is proud to announce its participation in National Apprenticeship Week, scheduled for November 17-23, 2024.
IPC Introduces First Standard for In-Mold Electronics
11/18/2024 | IPCIPC announces the release of IPC-8401, Guidelines for In-Mold Electronics. IPC-8401 addresses in-mold electronics (IME) technology, providing industry consensus on guidelines for manufacturing processes, part structures, material selection, and production test methods to integrate printed electronics and components into 3D smart structures.
Disruptive Innovation and Generative AI Inventor, Kevin Surace, to Keynote IPC APEX EXPO 2025
11/15/2024 | IPCEach year, IPC APEX EXPO features industry’s most dynamic, innovative minds to deliver keynote presentations that are both educational and entertaining. IPC APEX EXPO 2025 will feature Kevin Surace, an internationally renowned futurist and generative artificial intelligence (AI) innovator.