Suprema ID Receives FBI PIV/FAP30 Certification
September 16, 2019 | ACN NewswireEstimated reading time: 1 minute
Suprema ID has announced that the company's BioMini Slim 3, the world's slimmest FAP30 optical fingerprint authentication scanner, received FBI PIV (Personal Identity Verification) and Mobile ID FAP30 certification, tested under the FBI's Next Generation Identification (NGI) Image Quality Specifications (IQS).
The new BioMini Slim 3 features an array of cutting-edge technologies including 15mm ultra-slim FAP30 optical sensor with wider platen, Suprema ID's proprietary Multi-dynamic Range (MDR) technology and IP65-rated dust and waterproof structure ensuring robust operation over time under harsh environments. BioMini Slim 3 provides state-of-the-art Live Finger Detection (LFD) technology by applying machine learning based AI (Artificial Intelligence) which can be upgradeable by BioMini Slim 3 SDK.
"BioMini Slim 3 is designed to provide the best reliable performance over dynamic conditions such as outdoor and mobile environments. In addition, we have responded to the increased market demand for FAP30 fingerprint scanners," said Bogun Park, CEO of Suprema ID. "With the range-leading performance and usability, BioMini Slim will lead the emerging FAP30 scanner segment. We will keep focus on providing the best product beyond market expectation with the highest convenience and security," Park added.
About Suprema ID
Suprema ID is a leading global provider of biometrics and ID solutions. By combining the world's renowned biometric algorithm with superior engineering, Suprema ID continually designs and develops industry-leading products and solutions. Suprema ID's extensive range of portfolio includes fingerprint enrollment scanners, fingerprint authentication scanners, fingerprint embedded modules and ePassport readers. Suprema has provided national ID projects in more than 20 countries and over 1 billion people in the world are using Suprema ID's fingerprinting technology. For more information, please visit www.suprema-id.com.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
United Electronics Corporation Unveils Revolutionary CIMS Galaxy 30 Automated Optical Inspection System
09/11/2025 | United Electronics CorporationUnited Electronics Corporation (UEC) today announced the launch of its new groundbreaking CIMS Galaxy 30 Automated Optical Inspection (AOI) machine, setting a new industry standard for precision electronics manufacturing quality control. The Galaxy 30, developed and manufactured by CIMS, represents a significant leap forward in inspection technology, delivering exceptional speed improvements and introducing cutting-edge artificial intelligence capabilities.
Intel Announces Key Leadership Appointments to Accelerate Innovation and Strengthen Execution
09/09/2025 | Intel CorporationIntel Corporation today announced a series of senior leadership appointments that support the company’s strategy to strengthen its core product business, build a trusted foundry, and foster a culture of engineering across the business.
DARPA, State of New Mexico Establish Framework to Advance Quantum Computing
09/08/2025 | DARPAAs part of the Quantum Benchmarking Initiative (QBI), DARPA signed an agreement with the State of New Mexico’s Economic Development Department to create the Quantum Frontier Project.
LPKF Strengthens LIDE Technology Leadership with New Patent Protection in Korea
09/04/2025 | LPKFLPKF Laser & Electronics SE today announced that its groundbreaking LIDE (Laser Induced Deep Etching) technology has received additional patent protection in Korea through the Korean Patent Office (KPCA), effective September 1, 2025.
UHDI Fundamentals: UHDI Technology and Industry 4.0
09/03/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in the context of Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. Here, I’ll explore the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.