-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueThe Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
Solder Printing
In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Advanced Inspection Systems from MIRTEC at SMTA Guadalajara
September 23, 2019 | MirtecEstimated reading time: 1 minute
MIRTEC will exhibit at the SMTA Guadalajara Expo & Tech Forum, scheduled to take place October 23–24, 2019 at the Expo Guadalajara. The MIRTEC team will showcase the all new MV-6 OMNI 3D AOI Machine and award-winning MS-11e 3D SPI Machine.
The MV-6 OMNI combines MIRTEC's exclusive 15 Mega Pixel CoaXPress camera technology with their proprietary OMNI-VISION 3D Digital Tri-Frequency Moiré technology to provide precision inspection of SMT devices on finished PCB assemblies. MIRTEC’s exclusive 15 Mega Pixel CoaXPress camera system is designed and manufactured by MIRTEC for use with its complete product range of inspection equipment.
MIRTEC's proprietary Digital Tri-Frequency Moiré Technology, provides superior 3D inspection of SMT and through-hole devices up to 25 mm tall. This industry-acclaimed technology yields precise height measurement data used to detect lifted component and lifted lead defects as well as solder volume post reflow. Fully configured the new MIRTEC MV-6 OMNI machines feature four (4) 10 Mega Pixel Side-View cameras in addition to the 15 Mega Pixel Top-Down camera. There is little doubt that this new technology has set the standard by which all other inspection equipment are measured.
MIRTEC’s award-winning MS-11e 3D SPI Machine is configured with an exclusive 15 Mega Pixel CoaXPress camera system, providing enhanced image quality, superior accuracy and incredibly fast inspection rates.
The MS-11e uses dual -projection shadow-free Moiré phase shift imaging technology to inspect solder paste depositions on PCBs post screen print for insufficient solder, excessive solder, shape deformity, shift of deposition and bridging. The MS-11e uses the same robust platform as MIRTEC's MV-6 OMNI Series.
MIRTEC's total quality management system software, INTELLISYS also will be on display at SMTA International. This software suite promotes continuous process improvement by allowing manufacturers to track and eliminate defects on inspected assemblies.
About MIRTEC
MIRTEC is a leading global supplier of automated inspection systems to the electronics manufacturing industry. For further information, please visit www.mirtec.com
Suggested Items
Indium Corporation to Showcase Precision Gold Solder Solutions at MEDevice Silicon Valley 2024
11/18/2024 | Indium CorporationIndium Corporation® will feature its high-reliability AuLTRA® MediPro gold solder solutions at MEDevice Silicon Valley, taking place on November 20-21 in Silicon Valley, California. AuLTRA® MediPro is a family of high-performance, precision gold solder solutions for critical medical applications.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Silicon Valley Expo & Tech Forum
11/14/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Silicon Valley Expo & Tech Forum taking place on December 5 at the Fremont Marriott Silicon Valley in Fremont, California.
Data-driven Precision in PCBA Manufacturing
11/13/2024 | Julie Cliche-Dubois, CogiscanThe intricacies involved in electronics manufacturing require more than just expensive equipment and skilled technicians; they necessitate an accurate understanding of the entire production flow, informed and driven by access and visibility to reliable data.
Rehm Thermal Systems Mexico Wins the Mexico Technology Award 2024 in the Category Convection Soldering
11/13/2024 | Rehm Thermal SystemsRehm Thermal Systems Mexico has won the Mexico Technology Award in the category convection soldering with the patented mechatronic curtain for convection soldering systems.
SMTA: Capital Chapter & Connecticut Chapter Joint Technical Webinar
11/12/2024 | SMTAThe SMTA Capital Chapter is co-hosting a free webinar for SMTA members with the SMTA Connecticut Chapter on Tuesday, November 19 at 11:00 a.m. EST.