-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Koh Young America Expands Sales and Service Groups
September 24, 2019 | Koh Young AmericaEstimated reading time: 2 minutes

"I follow a tried and true saying, 'Sales earns the customer, but Service keeps them'," said Juan Arango, managing director at Koh Young America. "Using this guiding principle, Koh Young America continues its industry momentum with hundreds of machine installations at new customers throughout the Americas. Not only do these customers recognize the technological benefits of our True 3D technology, they also experience our dedicated service and support group during the pre-sales effort too," he continued. To that end, Koh Young America has recently expanded its sales and service organization with the addition of Quintin Armstrong and Isaiah Smith to the Koh Young America Team.
Quintin Armstrong has joined Koh Young America as the senior manager of technical services and applications to strengthen our customer service group. He brings a wealth of industry-related experience and an interesting perspective from his many roles as industry supplier, service provider, and equipment user. During his career, Quintin has held multiple service and support management roles, as well as high level positions in sales and operations. In his new capacity, Quintin will reinforce our Technical Services Organization with overall responsibility for critical initiatives to maintain our customer satisfaction requirements here in the Americas.
Isaiah Smith, as Regional Sales Manager, will handle the greater Northeast & Atlantic region. Like Quintin, Isaiah has proven industry experience. In his most recent role, Isaiah built a significant knowledge base for the printing process while at ITW EAE working with MPM printers. During his tenure, he helped advocate how solder paste inspection can improve the overall solder printing process. "His print process knowledge, problem solving capability, and customer focus will immediately help Koh Young America expand its reach," said Joel Scutchfield, director of sales at Koh Young America.
"We are incredibly happy to have both of these industry professionals join the Koh Young America family. Both Quintin and Isaiah bring with them the experience, energy, and commitment necessary to help us continue breaking performance records and, more importantly, elevate the user experience," said Joel.
Learn more about Koh Young by visiting its website at www.KohYoung.com. Alternatively, visit Koh Young at the i4.0 Connect Forum in Fremont, CA (www.i40connectforum.com), SMTA International in booth 609 (www.SMTA.org/SMTAI), or at SMTA Guadalajara in booth 227 (www.SMTA.org/expos/#guadalajara).
About Koh Young Technology Inc.
Koh Young Technology Inc., the leading 3D measurement-based inspection equipment and solutions provider, performs an essential role for quality control and process optimization across a growing set of industries including printed circuit board assembly, machining and assembly process manufacturing, semiconductor manufacturing, and various medical fields. In addition to its corporate headquarters in Seoul, Koh Young has sales and support offices in Germany, Japan, Singapore, China, Mexico, and the United States. These local facilities ensure it sustains a close relationship with its growing customer base, while providing them with access to a global network of inspection and measurement experts.
Suggested Items
Koh Young Installs 24,000th Inspection System at Top 20 EMS
05/14/2025 | Koh YoungKoh Young, the global leader in True 3D measurement-based inspection and metrology solutions, proudly announces the installation of its 24,000th inspection system at a Top 20 Global EMS in Thailand.
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.