Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
Global Citizenship: Together for a Perfect PCB Solution
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
Practical Components to Debut Advanced Technologies at IWLPC
September 24, 2019 | Practical ComponentsEstimated reading time: 1 minute
Practical Components will exhibit in booth 31 at the 2019 International Wafer-Level Packaging Conference (IWLPC) from October 22-23, 2019 at DoubleTree by Hilton in San Jose, California. Practical Components has added many new test wafers for miniaturized surface mount technology (SMT) to its array of dummy components, solder training kits and PCB evaluation kits.
New at this year's conference, Practical will introduce the MB6020-0102JY advanced test wafer, which is the most challenging wafer to date. This 8" wafer contains 3.0mm daisy chained chips that enable users to experiment and refine the process with pad pitches of 60/55/50/45/40/35/30/25/and 20μm on each chip.
Also new this year is the Practical IPC/WHMA-A-620 Space Addendum Wire Harness Cable Training Kit. IPC/WHMA-A-620C-S provides additional requirements to IPC/WHMA-A-620C to ensure the reliability of cable and wire harness assemblies that must survive the vibration and thermal cyclic environments getting to and operating in space. The IPC/WHMA-A-620C-S space addendum kit is to be used in conjunction with the Practical IPC/WHMA-A-620 kit.
Practical Components also will feature Dummy Amkor eWLP-Wafers .4-CuPd-DC-NB 8" wafer-embedded copper pads, Dummy Amkor CSPnl-Wafers .4-DC-SAC405 8" wafers with SAC405 ball daisy-chained 0.4 mm pitch, Amkor 0.3 mm CVBGA and Test Vehicle and Jabil Solder Paste Evaluation Board and Kit.
Practical has supplies for all of today's essential technologies as well the products needed for companies to advance their products, technologies, processes and understanding into the future.
IWLPC brings together the semiconductor industry's most respected authorities addressing all aspects of Wafer-Level Packaging, 3D and Advanced Manufacturing and Test. Going into its 16th year the IWLPC is co-produced by Chip Scale Review, the leading international magazine addressing the semiconductor packaging industry and SMTA, the distinguished global association in electronic assembly and manufacturing.
To learn more about Practical Components’ product offerings and capabilities, stop by booth 31 at IWLPC or visit www.practicalcomponents.com.
About Practical Components
Practical Components is a team of dedicated electronics industry professionals offering value pricing, on-time delivery, and superior service to customers. The Practical Components team is ready to provide project assistance in the areas of technical component knowledge, drawings, component land patterns and PCB practice kits.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
09/17/2025 | Nash Bell -- Column: Knocking Down the Bone PileElectronic component salvaging is the practice of recovering high-value devices from PCBs taken from obsolete or superseded electronic products. These components can be reused in new assemblies, reducing dependence on newly purchased parts that may be costly or subject to long lead times.
Koh Young, Fuji, and Kurtz ERSA Drive Smart Manufacturing Solutions for EV and Automotive Electronics at Kunshan, China Technical Seminar
09/11/2025 | Koh YoungKoh Young Technology, the global leader in True 3D measurement-based inspection solutions, partnered with Fuji Corporation and Kurtz ERSA to host an exclusive technical seminar for leading automotive manufacturers in East China. Held on September 4 at Fuji’s factory in Kunshan, the event gathered participants representing over 35 companies.
MacDermid Alpha Presents at SMTA New Delhi, Bangalore Chapter, on Flux–OSP Interaction
09/09/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha contributes technical insights on OSP solderability at the Bangalore Chapter, SMTA reinforcing commitment to knowledge-sharing and industry collaboration.
Electra’s ElectraJet EMJ110 Inkjet Soldermask Now in Black & Blue at Sunrise Electronics
09/08/2025 | Electra Polymers LtdFollowing the successful deployment of Electra’s Green EMJ110 Inkjet Soldermask on KLA’s Orbotech Neos™ platform at Sunrise Electronics in Elk Grove Village, Illinois, production has now moved beyond green.
Absolute EMS: The Science of the Perfect Solder Joint
09/05/2025 | Absolute EMS, Inc.Absolute EMS, Inc., a six-time award-winning provider of fast turnaround, turnkey contract electronic manufacturing services (EMS), is drawing attention to the critical role of 3D Solder Paste Inspection (SPI) in ensuring the reliability of both FLEX and rigid printed circuit board assemblies (PCBAs).