-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSoldering Technologies
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
The Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Practical Components to Debut Advanced Technologies at IWLPC
September 24, 2019 | Practical ComponentsEstimated reading time: 1 minute
Practical Components will exhibit in booth 31 at the 2019 International Wafer-Level Packaging Conference (IWLPC) from October 22-23, 2019 at DoubleTree by Hilton in San Jose, California. Practical Components has added many new test wafers for miniaturized surface mount technology (SMT) to its array of dummy components, solder training kits and PCB evaluation kits.
New at this year's conference, Practical will introduce the MB6020-0102JY advanced test wafer, which is the most challenging wafer to date. This 8" wafer contains 3.0mm daisy chained chips that enable users to experiment and refine the process with pad pitches of 60/55/50/45/40/35/30/25/and 20μm on each chip.
Also new this year is the Practical IPC/WHMA-A-620 Space Addendum Wire Harness Cable Training Kit. IPC/WHMA-A-620C-S provides additional requirements to IPC/WHMA-A-620C to ensure the reliability of cable and wire harness assemblies that must survive the vibration and thermal cyclic environments getting to and operating in space. The IPC/WHMA-A-620C-S space addendum kit is to be used in conjunction with the Practical IPC/WHMA-A-620 kit.
Practical Components also will feature Dummy Amkor eWLP-Wafers .4-CuPd-DC-NB 8" wafer-embedded copper pads, Dummy Amkor CSPnl-Wafers .4-DC-SAC405 8" wafers with SAC405 ball daisy-chained 0.4 mm pitch, Amkor 0.3 mm CVBGA and Test Vehicle and Jabil Solder Paste Evaluation Board and Kit.
Practical has supplies for all of today's essential technologies as well the products needed for companies to advance their products, technologies, processes and understanding into the future.
IWLPC brings together the semiconductor industry's most respected authorities addressing all aspects of Wafer-Level Packaging, 3D and Advanced Manufacturing and Test. Going into its 16th year the IWLPC is co-produced by Chip Scale Review, the leading international magazine addressing the semiconductor packaging industry and SMTA, the distinguished global association in electronic assembly and manufacturing.
To learn more about Practical Components’ product offerings and capabilities, stop by booth 31 at IWLPC or visit www.practicalcomponents.com.
About Practical Components
Practical Components is a team of dedicated electronics industry professionals offering value pricing, on-time delivery, and superior service to customers. The Practical Components team is ready to provide project assistance in the areas of technical component knowledge, drawings, component land patterns and PCB practice kits.
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.