Driving Innovation: Direct Imaging vs. Conventional Exposure
It’s Only Common Sense: Selling to Today's Generation of Buyers
Dan’s Biz Bookshelf: ‘Believe in Better'
Quantum Dots: IDTechEx Research Analyses Changing and Expanding Application Landscape
September 24, 2019 | IDTechExEstimated reading time: 9 minutes
There are many other material development and innovation trends and opportunities. This is because the application space for QDs is expanding. An evolution within the use of QD in display is taking place. This evolution will see many technology transitions, each of which will be enabled by new material development and innovation. Many other applications are also either emerging or are already in very early phases of growth. These include image sensors, lighting, security tagging, phototherapy, agricultural conversion films, and so on. To learn more please consult the IDTechEx report – “Quantum Dot Materials and Technologies 2019-2029: Trends, Markets, Players.”
This report provides the most comprehensive analysis of the QD landscape, looking at applications, materials, and players. It provides application- and material-level ten-year forecast segmented by 11 applications; it offers detailed technology analysis as well as technology roadmaps; it provides up-to-date information and insights onto the key players in the industry as well as innovators.
To find out more about Printed Electronics research available from IDTechEx visit www.IDTechEx.com/research/PE or to connect with others on this topic, IDTechEx Events is hosting: Printed Electronics USA, the World's Largest Event on Printed & Flexible Electronics, November 20-21 2019, Santa Clara, USA www.IDTechEx.com/PEUSA
Page 3 of 3Share on:
Suggested Items
2025 ASEAN IT Spending Growth Slows to 5.9% as AI-Powered IT Expansion Encounters Post-Boom Normalization
06/26/2025 | IDCAccording to the IDC Worldwide Black Book: Live Edition, IT spending across ASEAN is projected to grow by 5.9% in 2025 — down from a robust 15.0% in 2024.
DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model
06/26/2025 | Andy Shaughnessy, I-Connect007I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.
United Electronics Corporation Advances Manufacturing Capabilities with Schmoll MDI-ST Imaging Equipment
06/24/2025 | United Electronics CorporationUnited Electronics Corporation has successfully installed the advanced Schmoll MDI-ST (XL) imaging equipment at their advanced printed circuit board facility. This significant technology investment represents a continued commitment to delivering superior products and maintaining their position as an industry leader in precision PCB manufacturing.
Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.
OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
06/21/2025 | BUSINESS WIREOKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in