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IPC Partners with Stephen F. Austin State University’s CARRI and the IPC Education Foundation for Workforce Development in Electronics Manufacturing

08/23/2024 | IPC
IPC announces a transformative partnership with Stephen F. Austin State University (SFASU)'s engineering department, the IPC Education Foundation and the Center for Applied Research and Rural Innovation (CARRI).

A French Design Community

08/21/2024 | Michelle Te, IPC Community
The French IPC Designers Council is a unique conglomerate of 250 members from all parts of the industry: EEs, designers, CAD engineers, PCB manufacturers, EMS suppliers, OEMs, and even some in component packaging, that encourages individuals to freely exchange their design issues without commercial considerations. Thomas Romont, a PCB manufacturer’s rep with more than 20 years of experience, especially in the design for manufacturing (DFM) process, leads this association with support from IPC.

Foxconn Inaugurates Residential Housing Complex In Industrial Park In India

08/20/2024 | Foxconn
Foxconn and the state government of Tamil Nadu in India today inaugurated a new residential complex in Vallam Vadagal Industrial Park. The complex provides a sustainable living community for thousands of employees of the world’s largest manufacturing service provider.  

Dana on Data: The Evolution of Fabrication Drawing

08/15/2024 | Dana Korf -- Column: Dana on Data
In June, IPC released an excellent white paper called “Next Generation Design Needs,” presenting the need for the transformation of disparate design tools and processes. It’s time to eliminate silos. This paper could have been released at any time since the 1990s since the fundamental challenge has not significantly improved. The accepted data transfer process assumes that the manufacturer will fix the design documentation so boards can be manufactured to meet the design, reliability, and cost requirements.

Latest Advancements in High-Reliability Electronics Focus of 2024 IPC High Reliability Forum

08/12/2024 | IPC
Ensuring reliability in high-voltage electronics, a new standardized test method for abrasion resistance of e-textiles, and assembly and solder joint X-ray challenges are just a few of technical conference topics offered at IPC’s High Reliability Forum October 9-10 at the McKimmon Center in Raleigh, N.C.
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