The Right Approach: Get Ready for ISO 9001 Version 6
Dan’s Biz Bookshelf: ‘Still Broke: Walmart’s Remarkable Transformation'
Driving Innovation: Depth Routing Processes—Achieving Unparalleled Precision in Complex PCBs
OpFires Program Advances Technology for Upper Stage, Achieves Preliminary Design Review
October 7, 2019 | DARPAEstimated reading time: 1 minute
DARPA’s Operational Fires (OpFires) program has reached a major program milestone, completing booster preliminary design review of an innovative two-stage tactical missile system. OpFires aims to develop and demonstrate a ground-launched hypersonic weapon system to engage critical, time-sensitive targets in contested environments.
“U.S. ground-based forces currently are limited in effective range of surface-to-surface precision fires. The goal for OpFires is to provide the combatant commander with options in force deployment, and allow persistent standoff from unpredictable land-launch positions,” said Maj. Amber Walker (U.S. Army), program manager for OpFires in the Tactical Technology Office. “The envisioned ‘tuneable’ propulsion system could offer mission flexibility for ground-to-ground tactical missiles.”
The first two phases of the program focus on the propulsion technologies required to deliver diverse payloads a variety of ranges. Since Phase 1 contract awards last fall, Aerojet Rocketdyne, Exquadrum, and Sierra Nevada Corporation (SNC) have made critical discoveries in advanced rocket motor technology for the OpFires upper stage, completing more than 30 motor trials from subscale through full size. These advances put the program on track for booster critical design review in late 2020.
Exquadrum completed a full-scale, full-duration test fire Sept. 19, which marked the performer’s culminating event for Phase 1. SNC has targeted October to complete its Phase 1 testing, and Aerojet Rocketdyne completed six subscale tests in August. Development activities will continue under Phase 2, which will culminate with multiple hot/static fires targeted for late 2020.
DARPA anticipates awards later this year for the third phase of the OpFires program, which aims to develop an operational system design leveraging propulsion systems concepts developed under the first two phases of the program. Phase 3 will conclude with integrated end-to-end flight tests to begin in 2022.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Deca, Silicon Storage Technology Announce Strategic Collaboration to Enable NVM Chiplet Solutions
09/11/2025 | Microchip Technology Inc.As traditional monolithic chip designs grow in complexity and increase in cost, the interest and adoption of chiplet technology in the semiconductor industry also increases.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).
Global Citizenship: Together for a Perfect PCB Solution
09/10/2025 | Tom Yang -- Column: Global CitizenshipIf there’s one thing we’ve learned in the past few decades of electronics evolution, it’s that no region has a monopoly on excellence. Whether it’s materials science breakthroughs in Europe, manufacturing efficiencies in China, or design innovations in Silicon Valley, the PCB industry thrives on collaboration.
The Shaughnessy Report: Winning the Signal Integrity Battle
09/09/2025 | Andy Shaughnessy -- Column: The Shaughnessy ReportWhen I first started covering this industry in 1999, signal integrity was the hip new thing in PCB design. Conference classes on signal integrity were packed to the walls, and an SI article was guaranteed to get a lot of reads.
The Signal Integrity Issue: Design007 Magazine September 2025
09/09/2025 | I-Connect007 Editorial TeamAs the saying goes, “If you don’t have signal integrity problems now, you will eventually.” This month, our experts share a variety of design techniques that can help PCB designers and design engineers achieve signal integrity.