Global Citizenship: Cultivating Cross-border Partnerships With Integrity
Nolan’s Notes: Moving Forward With Confidence
The Knowledge Base: Beyond the Badge—Why Membership Matters More Than Ever
GOEPEL Webinar: 100% Inspection of Hidden Solder Joints with AXI Within Line Cycle Time
October 9, 2019 | GOEPEL ElectronicEstimated reading time: 1 minute
GOEPEL electronic will be conducting a free webinar, “One X-ray, please. 100% inspection of hidden solder joints with AXI within line cycle time” on Tuesday, October 22 at 2:00 p.m. UTC, 4:00 p.m. CEST, 10:00 a.m. EDT, 9 a.m. CDT.
As a rule, densely populated and complex assemblies always have one thing in common: a large number of hidden solder joints under the housings of the components. These must be inspected to ensure quality. Automatic X-Ray systems (AXI) ensure greater confidence and much higher degree of quality.
The webinar addresses which system concepts are available for testing concealed solder joints (manual vs. automatic testing) and how 100% inspection can be achieved within the line cycle time. Scanning 3D X-Ray image acquisition is presented as the kay to enabling short cycle time with excellent defect detection.
Other Key Features:
- Comparison of two established 3D image acquisition methods on the market: stop-and-go and scanning X-ray image acquisition
- Difference between 2D, 2.5D and 3D X-Ray
- Practical examples of BGA, QFN, and LEDs to demonstrate how double-sided panels can be inspected fully automatically using 3D X-Ray
- Address the possibilities of defect detection and its limits
In the second part of the webinar, the topic of software will be examined in more detail - from wizard supported test program creation using an offline programming station, to execution of the test program using machine software in Smart Phone style, to verification station for classifying the defects found.
To register, visit GOEPEL electronic’s “One X-ray, please.” event page.
About GOEPEL electronic
GOEPEL electronic is a leading provider of innovative test and inspection solutions for printed circuit board assemblies (PCBAs) and electronic devices and systems. The company is divided into four divisions: Automotive Test Solutions, Embedded JTAG Solutions, Industrial Function Test and Inspection Solutions (AOI·AXI·SPI·IVS). Besides more than 240 employees, who work in the company’s headquarters in Jena/Germany, GOEPEL electronic runs several support and service offices in the UK, USA, India and China. A worldwide distribution ensures the local and on-site support of GOEPEL electronic’s products and solutions.
Share on:
Suggested Items
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
Breaking Silos with Intelligence: Connectivity of Component-level Data Across the SMT Line
06/09/2025 | Dr. Eyal Weiss, CybordAs the complexity and demands of electronics manufacturing continue to rise, the smart factory is no longer a distant vision; it has become a necessity. While machine connectivity and line-level data integration have gained traction in recent years, one of the most overlooked opportunities lies in the component itself. Specifically, in the data captured just milliseconds before a component is placed onto the PCB, which often goes unexamined and is permanently lost once reflow begins.
BEST Inc. Introduces StikNPeel Rework Stencil for Fast, Simple and Reliable Solder Paste Printing
06/02/2025 | BEST Inc.BEST Inc., a leader in electronic component rework services, training, and products is pleased to introduce StikNPeel™ rework stencils. This innovative product is designed for printing solder paste for placement of gull wing devices such as quad flat packs (QFPs) or bottom terminated components.
See TopLine’s Next Gen Braided Solder Column Technology at SPACE TECH EXPO 2025
05/28/2025 | TopLineAerospace and Defense applications in demanding environments have a solution now in TopLine’s Braided Solder Columns, which can withstand the rigors of deep space cold and cryogenic environments.
INEMI Interim Report: Interconnection Modeling and Simulation Results for Low-Temp Materials in First-Level Interconnect
05/30/2025 | iNEMIOne of the greatest challenges of integrating different types of silicon, memory, and other extended processing units (XPUs) in a single package is in attaching these various types of chips in a reliable way.