Trouble in Your Tank: Organic Addition Agents in Electrolytic Copper Plating
It’s Only Common Sense: Selling During an Economic Downturn
Marcy’s Musings: Can You Hear the Voices?
SEMI Releases 2019 Heterogeneous Integration Roadmap
October 14, 2019 | SEMIEstimated reading time: 2 minutes
SEMI has announced the 2019 release of the Heterogeneous Integration Roadmap (HIR). Designed to stimulate pre-competitive collaboration in order to advance heterogeneous integration technology development and accelerate electronics innovation, HIR provides a long-term vision for the electronics industry, identifying future technology requirements and potential solutions. SEMI is among five HIR sponsors.
SEMI members across the global electronics supply chain integrate separately manufactured components into assemblies to enhance electronics system functionality across a multitude of applications. The heterogeneous integration of wireless and mixed signal devices, bio-chips, power devices, optoelectronics and microelectromechanical systems in a single package places new requirements on the electronics industry as these diverse components are introduced into System-in-Package (SiP) architectures for the tremendous array of industries where electronics are used.
The HIR offers professionals, industry, academia and research institutes a comprehensive, strategic forecast of heterogeneous integration technology requirements to spur collaboration over the next 15 years. In addition, the HIR delivers a 25-year projection for heterogeneous integration of emerging devices and materials with longer research and development timelines.
"The broad industry support for the HIR is a clear mandate for us to stay ahead of the innovation curve and identify barriers that could slow the pace of growth in the electronics industry,” said Ajit Manocha, president and CEO of SEMI. “SEMI is firmly committed to support and connect the HIR with our members worldwide for long-term technology guidance and industry validation. HIR and other collaborations spanning the full supply chain are vital to identifying technology needs and ensuring the microelectronics industry thrives well into the future.”
“Today, we are seeing emerging technologies—such as AI, 5G, cloud, edge and data center, autonomous vehicles and wearable technology—that hold great promise for improving the lives of individuals across the globe,” said William Chen, chair of the Heterogeneous Integration Roadmap and ASE Fellow. “The HIR, with its broad input from industry and academia, represents an invaluable resource that sets the course for continued electronics industry growth, greater technology innovation and enhanced performance of devices across a wide variety of applications that can bring increased benefits to humanity.”
“When you consider the scope of the HIR, the numerous application domains it addresses, and the level of valued input from a wide range of global stakeholders, it’s clear that there is a strong commitment to advance the entire electronics ecosystem,” said Ravi Mahajan, Intel Fellow, High Density Interconnect Pathfinding, Intel Corporation, and IEEE, ASME Fellow. “Today’s innovators, as well as future technologists, are encouraged to leverage the extensive, informative guidance contained within the HIR and actively participate in its future evolution.”
About SEMI
SEMI connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies.
Share on:
Suggested Items
SERMA Microelectronics Expand its Facilities in La Rochelle
04/22/2025 | SERMA MicroelectronicsSERMA Microelectronics, a major player in specialized microelectronics, continues its growth with the acquisition of a building adjacent to its current site in La Rochelle.
UHDI Fundamentals: UHDI Drives Unique IoT Innovation in Farming
04/22/2025 | Anaya Vardya, American Standard CircuitsThe combination of UHDI's high-bandwidth capabilities and IoT's real-time data processing can lead to more efficient, immersive, and smarter IoT systems. This convergence of two revolutionary technologies is enabling quantum advancements in some very “unconventional” applications. The typical discussions around UHDI focus on our standard electronics industry market segments like milaero, medical, consumer electronics, etc. IoT is all about machines talking to other machines, machine learning, and artificial intelligence, but again, typically applied in our PCB and assembly operations.
Navigating Change, Mitigating Risk: We’ve Been Here Before
04/22/2025 | Marcy LaRont, PCB007 MagazineI visited with Tom Edman, president and CEO of TTM Technologies, and chair of the IPC Board of Directors. Tom candidly shares his insights into the implications of changes on the defense sector and the broader electronics manufacturing industry, especially concerning PCB manufacturing. With half of TTM’s business tied to defense, Tom discusses the potential opportunities and challenges arising from government initiatives, tariffs, and supply chain complexities.
Federal Electronics Continues Tradition of Giving Back Through McAuley Ministries’ Lunch on Us Program
04/21/2025 | Federal ElectronicsFederal Electronics, a leader in providing advanced electronic manufacturing services, is proud to give back to the local community through its ongoing support of McAuley Ministries.
Wiring the World Together: IPC and WHMA Unveil Global Wire Harness Competitions and Championship
04/21/2025 | IPCIPC, in collaboration with the Wiring Harness Manufacturer's Association (WHMA), has organized the first-ever World Wire Harness Competitions and Championship.