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Indium Technical Expert to Present at SiP Conference China

11/25/2024 | Indium Corporation
Indium Corporation Senior Area Technical Manager for East China Leo Hu is scheduled to deliver a presentation on Low-Temperature Solder Material in Semiconductor Packaging Applications at SiP China Conference 2024 on November 27 in Suzhou, China.

CHIPS for America Announces Up to $300M in Funding to Boost U.S. Semiconductor Packaging

11/21/2024 | U.S. Chamber of Commerce
The Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, and Arizona to accelerate the development of cutting-edge technologies essential to the semiconductor industry.

Global Citizenship: What I’ve Learned About the American PCB Business

11/20/2024 | Tom Yang -- Column: Global Citizenship
Navigating the complexities of the American PCB business has been an eye-opening experience. During my time in America, I have become more familiar with the American PCB business and doing business here. If I may, and with your indulgence, I would like to share my humble impressions of the American PCB industry and the American way of doing business, which I find interesting and admirable.

Spirit Announces Purchase Agreement with Tex Tech Industries for Intended Sale of FMI

11/19/2024 | Spirit AeroSystems, Inc.
Spirit AeroSystems Holdings, Inc. announces a purchase agreement to sell Fiber Materials, Inc (FMI) business based in Biddeford, Maine, and Woonsocket, Rhode Island, to Tex-Tech Industries, Inc. for $165,000,000 in cash, subject to customary adjustment.

Ventec to Become Primary PCB Materials Supplier for Teltonika

11/13/2024 | Ventec
Ventec International Group and high-tech design and manufacturing company Teltonika announce that Ventec is to become supply chain partner and primary supplier of PCB base materials to Teltonika, which is preparing to open a new PCB manufacturing plant at its base in Vilnius, Lithuania.
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