Insulectro and Electroninks Sign North American Distribution Agreement

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Electroninks, a leader in metal organic decomposition (MOD) inks for additive manufacturing and advanced semiconductor packaging, today announced a strategic collaboration and distribution partnership with Insulectro, a premier distributor of materials used in printed electronics and advanced interconnect manufacturing. This partnership strengthens Electroninks’ presence in North America while enhancing customer access to its MOD inks across key industries including aerospace, defense, automotive, and high-tech manufacturing.

Electroninks has successfully commercialized market-ready gold, silver, and platinum-based materials designed for inkjet, screen, and aerosol jet printing. These advanced materials are widely used across OEM design, commercial product development, and government research, reflecting growing demand for high-performance, additive manufacturing-ready inks. The decision to partner with Insulectro was driven by its robust customer engagement capabilities and proven ability to support early-stage design and OEM pathfinding programs, including the DoD.

“At Electroninks, we really value this relationship with Insulectro, which is a trusted, respected, and highly knowledgeable name with our customers and market. This relationship supports our advanced metallization products and overall critical materials supply chain initiatives with our customers here in North America,” said Melbs LeMieux, President and Co-Founder at Electroninks.

Insulectro, the largest distributor of materials used in the manufacturing of printed circuit boards and printed electronics, is excited to include Electroninks, Inc. in its portfolio of best-in-class products.

Patrick Redfern, Insulectro President and CEO, commented, “I can’t wait for the people building UHDI to see what this stuff can do. MOD is magic and has potential to replace the costly electroless process. This is a strategic move to support the companies in North America that are investing in additive and chip packaging technologies. America needs these companies to be successful!”

Insulectro’s North American footprint, with eleven stocking locations in the U.S. and Canada, ensures just-in-time delivery and inventory reliability for specialty manufacturing customers. The company’s deep technical expertise, hands-on support, and long-standing relationships with top-tier military, aerospace, and automotive manufacturers make Insulectro ideally positioned to support the introduction of new material technologies into high-performance applications.

Additionally, Insulectro’s strong supply infrastructure offers a strategic advantage in minimizing supply chain risk and avoiding international tariff implications, which is increasingly important for U.S.-based innovation programs and contract manufacturers.

“This partnership is a natural fit,” Dhaval Patel, CFO at Electroninks added. “Insulectro’s extensive network and application engineering capabilities allow us to better support customers at the design and prototyping stages—accelerating time to market for next-generation devices.”

Insulectro’s Redfern concluded, “Insulectro’s portfolio of materials is defined by bedrock products that are proven high performers, and our customers count on every day. And, our pioneering spirit, that Insulectro was built on, is always scanning for emerging technologies that will enable our customers to expand their capabilities.”