New Type of Transistor One Step Closer
October 18, 2019 | University of GroningenEstimated reading time: 2 minutes
In order to make transistors that operate using the spin of electrons, rather than their charge, it is necessary to find a way of switching spin currents on and off. Furthermore, the lifetime of the spins should at least be equal to the time taken for these electrons to travel through a circuit. University of Groningen scientists have now taken an important step forward by creating a device that meets both of these requirements, based on a double layer of graphene on top of a layer of tungsten disulfide. Their results have been published on 16 October in the journal Physical Review B.
Graphene, a two-dimensional form of carbon, is an excellent conductor of electron spins. However, it is difficult to manipulate spin currents in this material. Spin is a quantum mechanical property of electrons, which makes them behave like tiny magnets. The Physics of Nanodevices group at the University of Groningen, led by Professor Bart van Wees, is working on this problem. They have previously shown that it is possible to control spin currents if the graphene is placed on top of a layer of tungsten disulphide (another 2D material).
New Technique
"However, this approach reduces the lifetime of the spins," explains Siddhartha Omar, a postdoc in the Van Wees group. Tungsten is a metal, and its atoms influence the electrons passing through the graphene, dissipating the spin currents. This led Omar to use a double layer of graphene on the tungsten disulphide, based on the theory that electrons passing through the upper layer should 'feel' less of the metal atoms' influence.
Omar also used another new technique, in which two different types of spin current are passed through the graphene. Spin is a magnetic moment that has a given direction. In normal materials, the spins are not aligned. However, the magnetic moment of spin currents—like that of magnets—has a preferential alignment. Relative to the material through which the electrons are passing, their spins can either have an in-plane orientation or an out-of-plane orientation.
Energy Level
"We found that, as the electrons pass through the outer graphene layer, the in-plane spins are dissipated very quickly—in mere picoseconds. However, the lifetime of the out-of-plane spins is about one hundred times longer." This means that, even in the presence of tungsten disulphide, one component of spin currents (spins with an out-of-plane orientation) can travel far enough to be used in devices such as transistors.
The energy level of the spin currents observed by Omar caused them to pass through the upper layer of graphene. This energy level can be boosted by applying an electric field, pushing the spin currents into the lower layer. "Down there, the spins will feel the full effect of the metal atoms and the spin currents will quickly dissipate," Omar explains. This ability to switch the spin current off using an electric field is important, as it could be used to 'gate' transistors based on this technology.
"Unfortunately, certain technical limitations of the substrate on which we built these devices prevent us from creating electric fields that are strong enough to produce this gating effect," says Omar. "However, we have shown that it is possible to send spin currents through a heterostructure made of graphene and tungsten disulphide. That is an important step towards the creation of a spin transistor."
Suggested Items
Partial HDI: A Delicate Balance
10/30/2024 | I-Connect007 Editorial TeamPartial HDI can be the perfect solution for designers faced with escape routing from tight-pitch BGAs. But there are a variety of material, signal integrity, and DFM trade-offs to understand before you get fully into partial HDI. We asked Stephen Chavez to explain the fundamentals, as well as the details, of this promising process. Are you using partial HDI?
Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs
10/31/2024 | Team NCAB -- Column: Fresh PCB ConceptsPCBs are the backbone of modern electronics and the copper layers within these boards serve as the primary pathways for electrical signals. When designing and manufacturing PCBs, copper thickness is one of the most critical factors and significantly affects the board’s performance and durability. The IPC-6012F specification, the industry standard for the performance and qualification of rigid PCBs, sets clear guidelines on copper thickness to ensure reliability in different environments and applications.
Book Excerpt: The Printed Circuit Designer’s Guide to... DFM Essentials, Ch. 1
10/25/2024 | I-Connect007The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter details high-frequency materials, copper foil types, metal core PCBs, and the benefits of embedded capacitance and resistor materials in multilayer PCBs.
Designers Notebook: Implementing HDI and UHDI Circuit Board Technology
10/23/2024 | Vern Solberg -- Column: Designer's NotebookTo accommodate new generations of high I/O semiconductor packaging, circuit board technology has undergone significant changes in both the fabrication process method and the criteria for base material selection. The reason behind these changes is the new high-function semiconductor package families that require more terminals than their predecessors and a significantly narrower terminal pitch.
Partial HDI: A Complete Solution
10/10/2024 | I-Connect007 Editorial TeamWe recently spoke with IPC instructor Kris Moyer about partial HDI, a process that’s recently been growing in popularity. Partial HDI allows designers to escape route out from tight-pitch BGAs on one layer, where a mechanically drilled plated through-hole is not an option, while avoiding the complexity and expense of sequential lamination cycles. As Kris explains, this process doesn’t add much to the cost, and it’s fairly straightforward. But there are some competing signal integrity and fabrication requirements to contend with. We asked Kris to walk us through this process.