The Knowledge Base: The Era of Advanced Packaging
Standard of Excellence: Finding and Developing Future Leaders in Manufacturing
Global Sourcing Spotlight: Navigating the Variables of Holiday Schedules in Global Sourcing
MIRTEC Announces Technical Collaboration with Universal Instruments’ Advanced Process Lab
October 21, 2019 | MirtecEstimated reading time: 1 minute
MIRTEC has installed one of its award-winning MV-6 OMNI 3D AOI systems at Universal Instruments’ Advanced Process Lab (APL) in Conklin, New York. Universal’s APL offers comprehensive research, analytical and advanced assembly services that enable manufacturers to realize rapid product introduction, maximize yield and optimize reliability.
Brian D’Amico, president of MIRTEC’s North American Sales and Service Division stated, “We are very excited to partner with Universal Instruments’ in placing one of our technologically advanced 3D AOI systems in their Advanced Process Lab. Our intention is to collaborate on new inspection solutions for the electronics manufacturing industry, combining the strengths of MIRTEC’s 3D inspection technology with the expertise and process knowledge of UIC’s personnel. We look forward to a long and prosperous relationship moving forward.”
MIRTEC’s industry acclaimed MV-6 OMNI 3D AOI machines are configured with the company’s exclusive OMNI-VISION® 3D inspection system which combines 15 Mega Pixel CoaXPress camera technology with MIRTEC’s revolutionary Digital Tri-Frequency Moiré 3D system. This proprietary system yields precise height measurement data used to detect lifted component and lifted lead defects as well as 3D solder fillet inspection post reflow.
Fully configured the MV-6 OMNI systems feature four 10 mega pixel side-view cameras in addition to the 15 Mega Pixel CoaXPress Top-Down Camera as well as an 8-phase COLOR lighting system to provide precision inspection of SMT devices on finished PCB assemblies.
About Universal Instruments Corporation (UIC)
Universal Instruments Corporation (UIC) is a global leader in the design and manufacture of advanced automation and assembly equipment solutions for the electronics manufacturing industry. UIC delivers comprehensive solutions to a global customer base by leveraging exclusive process expertise combined with its innovative portfolio of flexible platforms for surface mount, insertion mount, advanced semiconductor packaging, and end-of-line automation. Universal Instruments is headquartered in Conklin, N.Y., USA, with offices in Europe, Asia and the Americas.
For more information about MIRTEC’s technologically advanced 3D inspection systems, please visit: www.mirtec.com.
Share on:
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.