Standard of Excellence: Anticipating Customer Needs Early and Often
The Knowledge Base: At the Forefront of Electronics Manufacturing
Global Citizenship: Training the Next Generation of Talent
MIRTEC Announces Technical Collaboration with Universal Instruments’ Advanced Process Lab
October 21, 2019 | MirtecEstimated reading time: 1 minute
MIRTEC has installed one of its award-winning MV-6 OMNI 3D AOI systems at Universal Instruments’ Advanced Process Lab (APL) in Conklin, New York. Universal’s APL offers comprehensive research, analytical and advanced assembly services that enable manufacturers to realize rapid product introduction, maximize yield and optimize reliability.
Brian D’Amico, president of MIRTEC’s North American Sales and Service Division stated, “We are very excited to partner with Universal Instruments’ in placing one of our technologically advanced 3D AOI systems in their Advanced Process Lab. Our intention is to collaborate on new inspection solutions for the electronics manufacturing industry, combining the strengths of MIRTEC’s 3D inspection technology with the expertise and process knowledge of UIC’s personnel. We look forward to a long and prosperous relationship moving forward.”
MIRTEC’s industry acclaimed MV-6 OMNI 3D AOI machines are configured with the company’s exclusive OMNI-VISION® 3D inspection system which combines 15 Mega Pixel CoaXPress camera technology with MIRTEC’s revolutionary Digital Tri-Frequency Moiré 3D system. This proprietary system yields precise height measurement data used to detect lifted component and lifted lead defects as well as 3D solder fillet inspection post reflow.
Fully configured the MV-6 OMNI systems feature four 10 mega pixel side-view cameras in addition to the 15 Mega Pixel CoaXPress Top-Down Camera as well as an 8-phase COLOR lighting system to provide precision inspection of SMT devices on finished PCB assemblies.
About Universal Instruments Corporation (UIC)
Universal Instruments Corporation (UIC) is a global leader in the design and manufacture of advanced automation and assembly equipment solutions for the electronics manufacturing industry. UIC delivers comprehensive solutions to a global customer base by leveraging exclusive process expertise combined with its innovative portfolio of flexible platforms for surface mount, insertion mount, advanced semiconductor packaging, and end-of-line automation. Universal Instruments is headquartered in Conklin, N.Y., USA, with offices in Europe, Asia and the Americas.
For more information about MIRTEC’s technologically advanced 3D inspection systems, please visit: www.mirtec.com.
Share on:
Suggested Items
KYZEN to Highlight Stencil and Cleaning Solutions at SMTA Monterrey
03/27/2025 | KYZEN'KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Monterrey Expo & Tech Forum scheduled to take place on Thursday, April 10 at the Cintermex Convention Center in Monterrey, Nuevo León. KYZEN cleaning experts will be on-site highlighting stencil cleaning chemistries KYZEN E5631J and CYBERSOLV C8882.
Indium to Showcase Proven EV Products and High-Reliability Alloys at Productronica China
03/26/2025 | Indium CorporationAs a global materials supplier and trusted partner in electric vehicle (EV) and e-Mobility manufacturing, Indium Corporation® is proud to showcase its high-reliability alloys and soldering solutions at Productronica China, March 26-28, in Shanghai, China.
SolderKing Enhances Brainboxes' Electronics Manufacturing with Expert Support and Advanced Materials
03/26/2025 | SolderKingIn modern electronics manufacturing, success relies on more than high-quality soldering materials. Technical knowledge and process expertise are just as crucial for achieving consistent results. SolderKing, a leading UK manufacturer, provides both, combining advanced consumables with specialist support to help manufacturers optimise their soldering processes.
AIM to Highlight Type 5 Solder and Other Leading Products at SMTA Monterrey Expo & Tech Forum
03/20/2025 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Monterrey Expo & Tech Forum taking place on April 10 at Cintermex in Monterrey, Nuevo Leon, Mexico.
Hentec Industries/RPS Automation to Showcase Valence 2508 at IPC Expo 2025
03/17/2025 | Hentec Industries/RPS AutomationThe Valence 2508 Selective Soldering System is engineered for high-mix, high-volume, advanced PCB production. It supports boards ranging from 25 x 25 mm to 559 x 559 mm (1 x 1 in. to 22 x 22 in.), with a maximum processing area of 508 x 508 mm (20 x 20 in.).