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Wafer Capacity by Feature Size Shows Rapid Growth
October 22, 2019 | IC InsightsEstimated reading time: Less than a minute
Leading-edge processes (
South Korea (Samsung) and Taiwan (TSMC) are currently the only two regions with fabs processing what are being called
Trends at the leading edge have been changing and the industry is departing from historical “norms.” The gray area of what constitutes a generation and how to measure the minimum process geometry gets more difficult every year. Therefore, any assumptions made regarding the wafer fab capacity of new process technologies can have a big impact on the forecast for wafer capacity by minimum feature size.
Other findings from the Global Wafer Capacity 2019-2023 report include:
- South Korea remains significantly more leading-edge (i.e.,
- When only the most advanced processes (
- Current leading-edge (
- Taiwan has the largest shares of capacity in the
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