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Advanced Electronics Packaging Digest

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Incap Germany Expands Soldering with SEHO SelectLine-C 500

08/18/2026 | Incap
Incap Germany has further expanded its selective soldering capabilities with the commissioning of a new SEHO SelectLine-C 500.

NXP Semiconductors Breaks Ground on Assembly and Test Site Expansion in Malaysia

08/14/2026 | NXP Semiconductors
NXP Semiconductors N.V. celebrated the groundbreaking of its new assembly and test (A&T) factory in Petaling Jaya, Malaysia, an expansion of the company’s existing A&T site.

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08/05/2026 | Globe Newswire
Rocket Lab Corporation, a global leader in launch services and space systems, announced it has been awarded a $397 million contract by the United States Space Force under the Space-Based Airborne Moving Target Indicator (SB-AMTI) program.

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DuPont announced its financial results for the second quarter ended June 30, 2026 and raised financial guidance for the full year 2026.

Kaney Announces $2.88 Million Investment to Expand BGT Aerospace Operations in Freeland

07/20/2026 | Kaney, Inc.
Kaney, Inc., a Velocity One portfolio company, today announced a $2.88 million investment in its BGT Aerospace facility in Freeland, Michigan, expanding manufacturing capacity, adding advanced production equipment, and reinforcing the company's long-term commitment to the local community
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