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How Successful Design Leads to Successful Assembly
October 25, 2019 | IPCEstimated reading time: Less than a minute
How do the decisions you make in the design process directly influence the reliability of your assembly?
Find out at the IPC Tech Ed Design for Excellence: DFM (design for manufacturing) DFR (design for reliability) DFA (design for assembly), which will be held on November 12, 2019, in Raleigh, North Carolina.
Here are the top five reasons why you should attend Design for Excellence:
1. Learn how PCB design affects fabrication costs, reliability and assembly.
2. Learn how often the pitfalls that can occur in assembly have a direct link to design.
3. Understand the impacts of design on process control issues; paste volume, SMT and PTH thermal shock, reflow warpage.
4. Study the impacts of component and PCB warpage/flatness on yields and reliability.
5. Spend the day with one of our most highly regarded instructors, Dale Lee, Senior Staff DFX Strategy Engineer, Plexus Corporation.
This day-long course is ideal for designers, manufacturing/process engineers, quality and reliability engineers and managers or technicians involved with the design, fabrication, assembly or testing of printed board assemblies.
For more information or to register, click here.
Suggested Items
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Siemens Delivers New Solido IP Validation Suite
05/07/2024 | SiemensSiemens Digital Industries Software introduced Solido™ IP Validation Suite software, a comprehensive, automated signoff solution for quality assurance across all design intellectual property (IP) types, including standard cells, memories and IP blocks.
Altair Acquires Research in Flight, Forging a New Path for Aerodynamic Analysis
05/07/2024 | AltairAltair a global leader in computational intelligence, announced it has acquired Research in Flight, maker of FlightStream®, which provides computational fluid dynamics (CFD) software with a large footprint in the aerospace and defense sector and a growing presence in marine, energy, turbomachinery, and automotive applications.
Happy’s Tech Talk #28: The Power Mesh Architecture for PCBs
05/07/2024 | Happy Holden -- Column: Happy’s Tech TalkA significant decrease in HDI substrate production cost can be achieved by reducing the number of substrate layers from conventional through-hole multilayers and microvia multilayers of eight, 10, 12 (and more), down to four. Besides reducing direct processing steps, yield will increase as defect producing operations are eliminated.
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