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Standard of Excellence: Building Excellence From the Inside Out
How do the decisions you make in the design process directly influence the reliability of your assembly?
Find out at the IPC Tech Ed Design for Excellence: DFM (design for manufacturing) DFR (design for reliability) DFA (design for assembly), which will be held on November 12, 2019, in Raleigh, North Carolina.
Here are the top five reasons why you should attend Design for Excellence:
1. Learn how PCB design affects fabrication costs, reliability and assembly.
2. Learn how often the pitfalls that can occur in assembly have a direct link to design.
3. Understand the impacts of design on process control issues; paste volume, SMT and PTH thermal shock, reflow warpage.
4. Study the impacts of component and PCB warpage/flatness on yields and reliability.
5. Spend the day with one of our most highly regarded instructors, Dale Lee, Senior Staff DFX Strategy Engineer, Plexus Corporation.
This day-long course is ideal for designers, manufacturing/process engineers, quality and reliability engineers and managers or technicians involved with the design, fabrication, assembly or testing of printed board assemblies.
For more information or to register, click here.
