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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
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Aismalibar to Attend productronica 2019
October 27, 2019 | AismalibarEstimated reading time: 1 minute
As the only exhibition of this kind, productronica showcases the entire value chain in electronics manufacturing – from technologies and components to software and services. Approximately 45,000 professionals attended the conference in 2018 and it continues to grow each year.
After successful participation in the 2018 edition of productronica, Aismalibar will attend the Munich event and showcase its latest developments in IMS laminates, as well as the new range of automation for production of PCBs of the Technosystem brand.
Aismalibar will be located in productronica Hall B3 with stand 351. In addition to offering personalized attention to all those who seek information, it will exhibit machinery from the Technosystem catalog, a brand of The Benmayor Group that develops technology and machinery for the production of PCBs. Aismalibar will also present its new range of loaders, unloaders and robots for the production of printed circuits.
Aismalibar will also showcase COBRITHERM ULTRATHIN 4W - TG180ºC - 150ºC MOT, an insulated metal substrate (IMS) based on an aluminum cladding with an ED copper sheet on the opposite side, containing an innovative ultra-thin polymer-ceramic dielectric layer of its own formulation, offering industry-leading thermal conductivity and high dielectric strength. It also offers strong MOT, high Tg and low CTE values, which are the key elements for performance of MPCBs operating at high temperatures.
The Thermal Multilayer product range will also be presented as well as products for the development of multilayer PCBs that can be combined to customize solutions for complex electronic designs and applications. THIN LAM and BOND SHEET can be used in standard multilayer lamination processes to improve resistance to thermal shocks, conductivity and thermal dissipation.
The new THIN LAM and BOND SHEETS of 3.2W have been developed to reduce thermal resistance. An MOT of 150ºC, high Tg values of 180ºC and low CTE below 1.8% (50 to 250ºC) considerably improve the overall thermal efficiency.
About Aismalibar
AISMALIBAR is a manufacturer of copper clad laminates who produces high quality base materials for the PCB industry. AISMALIBAR was one of the first IMS laminate manufacturers in the world and was the first in Europe.
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