-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueVoices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
It's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Weller to Supply Stations for SMTA Space Coast Expo Soldering Challenge
November 4, 2019 | Weller ToolsEstimated reading time: 2 minutes
Weller Tools, the world’s No. 1 brand in hand soldering solutions, is providing two soldering stations to support the SMTA Space Coast Chapter’s Third Annual Soldering Challenge at the upcoming exhibition and Tech Forum. The event will take place at 1 p.m. on November 20 at the Melbourne Auditorium in Melbourne, Florida.
During the challenge, 48 contestants, divided into eight heats, will be assigned the task of building a standard IPC mechanical sample circuit card assembly, using current soldering methods and materials, within a specified time frame. Tools will be furnished by participating vendors and suppliers, including Weller. Prizes will be awarded to the most and best solder joints per IPC-610 completed during the challenge.
In addition to donating two soldering stations for the Soldering Challenge, Weller is co-hosting the technical symposium with KIC, Indium Corporation and MicroCare Corporation.
Scheduled to take place from 9 a.m.-4 p.m., the focus of the full-day reliability event is to gather electronics industry leaders to deliver presentations in the areas of their expertise. Four technical presentations will be presented:
1. Industry 4.0 the Next Revolution: Smart Factory, MB Allen, KIC
2. Understanding Reliability of Low-Temperature Solders and New Developments in Low-Temperature Solder Materials: Kim Flanagan, Indium
3. Reliability of Robotics for Electronic Manufacturing: Bubba Powers, Weller Professional Tools
4. Cleaning for Reliability in Electronics: Emily Peck, MicroCare
The symposium is open to both SMTA member and non-members. Contact the SMTA Space Coast to register.
About Weller Tools
The Weller name stands for pioneering solutions in soldering technology. Founded in 1945, the company quickly grew to become the market leader in manual soldering technology. Weller's extensive range of products includes innovative solutions for industry and trade. The company's areas of expertise include conventional soldering technology such as extraction systems, precision tools and solutions involving screws, bolts and robots as well as many other benchtop products and services.
Weller Tools is part of the umbrella company Apex Tool Group, LLC. Apex Tool Group, LLC, headquartered in Sparks, Maryland, is a leading global manufacturer and supplier of high performance hand and power tools, tool storage, drill chucks, chain and electrical soldering products for industrial, commercial and demanding do-it-yourself applications. ATG designs, manufactures, markets, and sells proprietary brands, including GEARWRENCH, Crescent, SATA, Cleco, Weller®, and APEX and also designs and manufactures a number of private label tool brands for retailers. ATG sells its products through direct, retail, professional and trade channels to customers in over 115 countries, and serves a multitude of global markets, including automotive, aerospace, electronics, energy, hardware, industrial, and consumer retail.
Learn more at www.apextoolgroup.com.
Suggested Items
Koh Young Installs 24,000th Inspection System at Top 20 EMS
05/14/2025 | Koh YoungKoh Young, the global leader in True 3D measurement-based inspection and metrology solutions, proudly announces the installation of its 24,000th inspection system at a Top 20 Global EMS in Thailand.
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.