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Current IssueEngineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
Technology Roadmaps
In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
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Meet Industry Experts at the 2019 International Electronics Circuit Exhibition (Shenzhen)!
November 15, 2019 | HKPCAEstimated reading time: 1 minute
The International Technical Conference, to be held concurrently with the 2019 International Electronics Circuit Exhibition (Shenzhen) (formerly International Printed Circuit & APEX South China Fair), gives you valuable insights on the latest market trends to prepare you to face challenges and transform your business to a new level. Join us for the Conference at the Shenzhen Convention & Exhibition Center, China, 4-6 December 2019.
Stay on top with the industry leaders and experts
The 2019 Conference will feature international specialists and industry experts to address the hottest topics covering both market trend and technical updates of the industry. Here are some hot sessions that you can't miss!
- Keynote Speeches from Mr Canice Chung and Mr. You Lei, Chairmen HKPCA
- The Challenge and Opportunity of 5G High Frequency to PCB and PCBA, Mr. Liu Zhe Chief Engineer, ZTE Corporation
- Which Way is the PCB Industry Heading? Dr. Hayao Nakahara, President, N.T. Information Ltd.
- PCB Market Update, Dr. Shiuh-Kao Chiang, Managing Partner, Prismark
- IC Substrate Technology Characteristics Study, Mr. Lin Ting Hao, Sr. Project Director, Kinsus Interconnect Technology Corp.
- Challenges and Opportunity to PCB Material and Processing Technology from Automotive Electronics, Mr. James Tam, Project Manager, Robert Bosch Co., Ltd.
Get the latest show news at HKPCAshow.org.
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11/22/2024 | Andy Shaughnessy, I-Connect007In this week’s roundup, I’m highlighting a variety of articles. We have an interview with Jess Hollenbaugh, a recent graduate working for Polar Instruments. We also have an interview with IPC’s Matt Kelly and Devan Iyer, whose white paper may provide a way forward for companies dealing with complex advanced packages. Our newest columnist Tom Yang describes the U.S. PCB industry from the point of view of a technologist from another country, and Dan Beaulieu has a review of Malcolm Gladwell’s follow-up to The Tipping Point. Finally, we have my review of PCB Carolina, a one-day tabletop show that keeps expanding, much like my waistline after eating their catered food. Enjoy!
Western Digital CEO David Goeckeler Elected Chair of Semiconductor Industry Association
11/22/2024 | SIAThe Semiconductor Industry Association (SIA) today announced Western Digital CEO David Goeckeler has been elected Chair of the SIA Board of Directors. SIA represents 99% of the U.S. semiconductor industry by revenue and nearly two-thirds of non-U.S. chip firms.
Meet Polar's New Product Specialist Jess Hollenbaugh
11/21/2024 | Andy Shaughnessy, I-Connect007At PCB West, I spoke with Jess Hollenbaugh, a recent college graduate who has now joined Polar Instruments. In this interview, she shares her journey from a physics student focused on high-energy astrophysics to her new role at Polar. Her insights provide a glimpse into the dynamic opportunities awaiting those who venture into this evolving industry.
SIA Applauds CHIPS Award for Semiconductor Research Corporation’s SMART USA Institute
11/21/2024 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer commending the announcement that the U.S. Department of Commerce and the Semiconductor Research Corporation Manufacturing Consortium Corporation (SRC) are entering negotiations for the Commerce Department to provide SRC $285 million to establish and operate the CHIPS Manufacturing USA Institute for Digital Twins.
IPC Issues Clarion Call for EU to Reclaim Leadership in Electronics Manufacturing
11/21/2024 | IPCIPC released a synopsis of its recent white paper, Securing the European Union’s Electronics Ecosystem. This condensed document presents a comprehensive overview of the current challenges in Europe’s electronics manufacturing industry and shares actionable steps to help the EU achieve a stronger, more autonomous ecosystem.