-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueVoices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
It's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Atotech to Present at the HKPCA 2019 International Electronics Circuit Exhibition
November 22, 2019 | AtotechEstimated reading time: 1 minute
Atotech, a leading surface-finishing solutions provider, delivering chemistry, equipment, and service to support diverse end-markets such as mobile devices, computers, consumer electronics, the global automotive industries, and many others, will present at the 2019 International Electronics Circuit Exhibition in Shenzhen, China, on December 4th – 6th.
On Thursday, December 5, Atotech expert Kuldip Johal will give a presentation entitled: “Moving to mmWave—how does this impact the PCB/IC substrate,” from 2:00 – 2:40 p.m. at the International Technical Conference area in hall 4.
Visitors of the HKPCA 2019 are welcome to join Atotech’s expert talk on 5G trends, challenges and solutions and to stop by the company’s booth 2D21. Mr. Johal and several other global and local Atotech experts will be available to discuss the latest product innovations and trends.
Atotech’s key highlights at the booth include:
- vPlate®—Vertical continuous copper plating technology of choice for advanced HDI and IC substrate.
- Polygon® PLB Line®—Atotech’s new desmear and electroless copper system.
- ViaKing®—Atotech's new enhanced graphite direct metallization for flex and advanced base materials.
- Noviganth® AF—High build self-accelerating electroless copper process.
- InPro® THF2—Atotech’s (a)mSAP BMV filling process for best uniformity with high ductility.
- InPro® MVF2—Advanced BMV filling in VCP equipment for HDI production.
- BondFilm® HF1000—Bonding enhancement process for high frequency manufacturing.
- CupraEtch® SR8000—Dryfilm and soldermask pretreatment with advanced adhesion performance.
- PallaBond®—Direct pure EPAG for ultra fine L/S application.
- Stanna-COF—Immersion tin for chip on film.
- Spherolyte® Cu UF3—Cu RDL process for fine line plating and microvia filling.
For more information about Atotech or its product offering, please visit www.atotech.com or contact us at: info@atotech.com.
About Atotech:
Atotech is a global leader in surface-finishing solutions. Through a comprehensive systems-and-solutions approach, the company delivers chemistry, equipment, and service to support diverse industries such as consumer electronics, especially mobile devices and computers; global automotive; communication infrastructure; and many other industrial end-markets. Atotech’s relentless R&D efforts and global TechCenter presence allows it to deliver pioneering and sustainable products combined with unparalleled on-site customer support—making Atotech a critical partner to over 8,000 customers worldwide. Atotech is a team of 3,800 experts in over 40 countries generating annual revenues of $1.2 billion (2018). Atotech has manufacturing operations across Europe, the Americas, and Asia and its headquarters is in Berlin, Germany.
Suggested Items
Legislative Update – The SEMI Investment Act: Inclusive of PCB and Substrates?
05/13/2025 | I-Connect007 Editorial TeamIn response to yesterday’s news around new U.S. legislation being put forth by SEMI to support our domestic electronics supply chain–The SEMI Investment Act, or the Strengthening Essential Manufacturing and Industrial Act– I reached out to IPC’s Richard Capetto, chief lobbyist and a principal member of IPCs Global Relations and Advocacy team.
The Test Connection Inc. Appoints USM Reps as Exclusive Sales Representative in Mexico
05/13/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a leading provider of electronic test and manufacturing solutions, is pleased to announce the appointment of USM Reps as its exclusive sales representative in Mexico.
Top 10 OSAT Companies of 2024 Revealed—China Players See Double-Digit Growth, Reshaping the Global Market Landscape
05/13/2025 | TrendForceTrendForce’s latest report on the semiconductor packaging and testing (OSAT) sector reveals that the global OSAT industry in 2024 faced dual challenges from accelerating technological advancements and ongoing industry consolidation.
Delta Builds First IPC-CFX Demonstration Line in Asia-Pacific
05/14/2025 | Chuck Li, IPC North AsiaAs a key standard in the global electronics manufacturing industry, IPC-CFX has been implemented in various regions worldwide, providing the foundation for digital factory solutions. In the Asia-Pacific region, IPC actively promotes this standard, helping enterprises enhance efficiency and competitiveness through digital transformation.
Beyond the Board: Empowering the Next Generation of Tech Innovators in Electronics
05/13/2025 | Jesse Vaughan -- Column: Beyond the BoardThe electronics industry is at the heart of technological progress, driving innovative advancements that shape our world. Yet, despite the sector's rapid evolution, it faces a looming challenge: attracting and retaining young talent. With an aging workforce and an increasing demand for skilled professionals, the industry must find ways to inspire the next generation of innovators.