It’s Only Common Sense: Invest in Yourself—You’re Your Most Important Resource
Dan's Biz Bookshelf: 'Revenge of the Tipping Point'
Marcy's Musings: Engineering Economics
Atotech to Present at the HKPCA 2019 International Electronics Circuit Exhibition
November 22, 2019 | AtotechEstimated reading time: 1 minute
Atotech, a leading surface-finishing solutions provider, delivering chemistry, equipment, and service to support diverse end-markets such as mobile devices, computers, consumer electronics, the global automotive industries, and many others, will present at the 2019 International Electronics Circuit Exhibition in Shenzhen, China, on December 4th – 6th.
On Thursday, December 5, Atotech expert Kuldip Johal will give a presentation entitled: “Moving to mmWave—how does this impact the PCB/IC substrate,” from 2:00 – 2:40 p.m. at the International Technical Conference area in hall 4.
Visitors of the HKPCA 2019 are welcome to join Atotech’s expert talk on 5G trends, challenges and solutions and to stop by the company’s booth 2D21. Mr. Johal and several other global and local Atotech experts will be available to discuss the latest product innovations and trends.
Atotech’s key highlights at the booth include:
- vPlate®—Vertical continuous copper plating technology of choice for advanced HDI and IC substrate.
- Polygon® PLB Line®—Atotech’s new desmear and electroless copper system.
- ViaKing®—Atotech's new enhanced graphite direct metallization for flex and advanced base materials.
- Noviganth® AF—High build self-accelerating electroless copper process.
- InPro® THF2—Atotech’s (a)mSAP BMV filling process for best uniformity with high ductility.
- InPro® MVF2—Advanced BMV filling in VCP equipment for HDI production.
- BondFilm® HF1000—Bonding enhancement process for high frequency manufacturing.
- CupraEtch® SR8000—Dryfilm and soldermask pretreatment with advanced adhesion performance.
- PallaBond®—Direct pure EPAG for ultra fine L/S application.
- Stanna-COF—Immersion tin for chip on film.
- Spherolyte® Cu UF3—Cu RDL process for fine line plating and microvia filling.
For more information about Atotech or its product offering, please visit www.atotech.com or contact us at: info@atotech.com.
About Atotech:
Atotech is a global leader in surface-finishing solutions. Through a comprehensive systems-and-solutions approach, the company delivers chemistry, equipment, and service to support diverse industries such as consumer electronics, especially mobile devices and computers; global automotive; communication infrastructure; and many other industrial end-markets. Atotech’s relentless R&D efforts and global TechCenter presence allows it to deliver pioneering and sustainable products combined with unparalleled on-site customer support—making Atotech a critical partner to over 8,000 customers worldwide. Atotech is a team of 3,800 experts in over 40 countries generating annual revenues of $1.2 billion (2018). Atotech has manufacturing operations across Europe, the Americas, and Asia and its headquarters is in Berlin, Germany.
Share on:
Suggested Items
NEOTech Significantly Improves Wire Bond Pull Test Process
11/25/2024 | NEOTechNEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, proudly announces a major advancement in its wire bond pull testing process, reducing manufacturing cycle time by more than 60% while maintaining industry-leading production yields of over 99.99%.
PCB Design Software Market Expected to Hit $9.2B by 2031
11/21/2024 | openPRThis report provides an overview of the PCB design software market, detailing key market drivers, challenges, technological advancements, regional dynamics, and future trends. With a projected compound annual growth rate (CAGR) of 13.4% from 2024 to 2031, the market is expected to grow from USD 3.9 billion in 2024 to USD 9.2 billion by 2031.
IPC Issues Clarion Call for EU to Reclaim Leadership in Electronics Manufacturing
11/21/2024 | IPCIPC released a synopsis of its recent white paper, Securing the European Union’s Electronics Ecosystem. This condensed document presents a comprehensive overview of the current challenges in Europe’s electronics manufacturing industry and shares actionable steps to help the EU achieve a stronger, more autonomous ecosystem.
IPC Celebrates National Apprenticeship Week with a Focus on Electronics Manufacturing Excellence
11/19/2024 | IPCIPC, a leading global electronics industry association and source for industry standards, training and advocacy, is proud to announce its participation in National Apprenticeship Week, scheduled for November 17-23, 2024.
IPC Introduces First Standard for In-Mold Electronics
11/18/2024 | IPCIPC announces the release of IPC-8401, Guidelines for In-Mold Electronics. IPC-8401 addresses in-mold electronics (IME) technology, providing industry consensus on guidelines for manufacturing processes, part structures, material selection, and production test methods to integrate printed electronics and components into 3D smart structures.